Issued Patents All Time
Showing 76–100 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8853000 | Package on package structrue and method for manufacturing same | Chien-Chih Chen, Hong-Xia Shi | 2014-10-07 |
| 8829356 | Packaging substrate having a passive element embedded therein and method of fabricating the same | Zhao-Chong Zeng | 2014-09-09 |
| 8779300 | Packaging substrate with conductive structure | — | 2014-07-15 |
| 8709940 | Structure of circuit board and method for fabricating the same | Shing-Ru Wang, Hsien-Shou Wang | 2014-04-29 |
| 8711572 | Circuit board having semiconductor chip embedded therein | — | 2014-04-29 |
| 8633587 | Package structure | — | 2014-01-21 |
| 8610006 | Lid for micro-electro-mechanical device and method for fabricating the same | Kun-Chen Tsai, Micallaef Ivan | 2013-12-17 |
| 8580608 | Fabrication method of package structure having embedded semiconductor component | I-Ta Tsai | 2013-11-12 |
| 8531021 | Package stack device and fabrication method thereof | Chu-Chin Hu, Yi-Ju Chen | 2013-09-10 |
| 8436463 | Packaging substrate structure with electronic component embedded therein and method for manufacture of the same | — | 2013-05-07 |
| 8399778 | Circuit board structure and fabrication method thereof | — | 2013-03-19 |
| 8227711 | Coreless packaging substrate and method for fabricating the same | — | 2012-07-24 |
| 8110896 | Substrate structure with capacitor component embedded therein and method for fabricating the same | — | 2012-02-07 |
| 8101866 | Packaging substrate with conductive structure | — | 2012-01-24 |
| 8070932 | Circuit board with identifiable information and method for fabricating the same | Shang-Wei Chen, Suo-Hsia Tang, Chao-Wen Shih | 2011-12-06 |
| 8058105 | Method of fabricating a packaging structure | — | 2011-11-15 |
| 8058718 | Package substrate embedded with semiconductor component | Kan-Jung Chia | 2011-11-15 |
| 8058721 | Package structure | — | 2011-11-15 |
| 8058566 | Packaging substrate structure and manufacturing method thereof | — | 2011-11-15 |
| 8022513 | Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same | — | 2011-09-20 |
| 8017442 | Method of fabricating a package structure | — | 2011-09-13 |
| 7973398 | Embedded chip package structure with chip support protruding section | — | 2011-07-05 |
| 7969745 | Circuit board structure having electronic components integrated therein | Kan-Jung Chia | 2011-06-28 |
| 7956472 | Packaging substrate having electrical connection structure and method for fabricating the same | — | 2011-06-07 |
| 7906850 | Structure of circuit board and method for fabricating same | Shing-Ru Wang, Hsien-Shou Wang | 2011-03-15 |