Issued Patents All Time
Showing 126–150 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7519244 | Circuit board with optoelectronic component embedded therein | — | 2009-04-14 |
| 7514786 | Semiconductor chip electrical connection structure | — | 2009-04-07 |
| 7508006 | Circuit board structure of integrated optoelectronic component | — | 2009-03-24 |
| 7485970 | Semiconductor package substrate having contact pad protective layer formed thereon | Kun-Chen Tsai | 2009-02-03 |
| 7453155 | Method for fabricating a flip chip package | — | 2008-11-18 |
| 7450793 | Semiconductor device integrated with opto-electric component and method for fabricating the same | — | 2008-11-11 |
| 7449363 | Semiconductor package substrate with embedded chip and fabrication method thereof | — | 2008-11-11 |
| 7446402 | Substrate structure with embedded semiconductor chip and fabrication method thereof | — | 2008-11-04 |
| 7435618 | Method to manufacture a coreless packaging substrate | Bo-Wei Chen, Hsien-Shou Wang | 2008-10-14 |
| 7419850 | Method to manufacture a coreless packaging substrate | Bo-Wei Chen, Hsien-Shou Wang | 2008-09-02 |
| 7396700 | Method for fabricating thermally enhanced semiconductor device | — | 2008-07-08 |
| 7382057 | Surface structure of flip chip substrate | — | 2008-06-03 |
| 7365272 | Circuit board with identifiable information and method for fabricating the same | Shang-Wei Chen, Suo-Hsia Tang, Chao-Wen Shih | 2008-04-29 |
| 7359590 | Semiconductor device integrated with optoelectronic components | — | 2008-04-15 |
| 7351916 | Thin circuit board | — | 2008-04-01 |
| 7350298 | Method for fabricating circuit board with conductive structure | Sao-Hsia Tang, Ying-Tung Wang, Wen-Hung Hu, Chao-Wen Shih | 2008-04-01 |
| 7341934 | Method for fabricating conductive bump of circuit board | Sao-Hsia Tang, Ying-Tung Wang, Wen-Hung Hu, Chao-Wen Shih, Meng-Da Chou | 2008-03-11 |
| 7321164 | Stack structure with semiconductor chip embedded in carrier | — | 2008-01-22 |
| 7319276 | Substrate for pre-soldering material and fabrication method thereof | Chu-Chin Hu | 2008-01-15 |
| 7313294 | Structure with embedded opto-electric components | — | 2007-12-25 |
| 7312405 | Module structure having embedded chips | — | 2007-12-25 |
| 7302126 | Circuit board structure of integrated optoelectronic componenet | — | 2007-11-27 |
| 7276800 | Carrying structure of electronic components | — | 2007-10-02 |
| 7274099 | Method of embedding semiconductor chip in support plate | — | 2007-09-25 |
| 7242092 | Substrate assembly with direct electrical connection as a semiconductor package | — | 2007-07-10 |