Issued Patents All Time
Showing 151–167 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7239525 | Circuit board structure with embedded selectable passive components and method for fabricating the same | — | 2007-07-03 |
| 7174630 | Method for fabricating connection terminal of circuit board | Sao-Hsia Tang, Chao-Wen Shih | 2007-02-13 |
| 7174631 | Method of fabricating electrical connection terminal of embedded chip | Kun-Chen Tsai | 2007-02-13 |
| 7151050 | Method for fabricating electrical connection structure of circuit board | Sao-Hsia Tang, Chao-Wen Shih, Ying-Tung Wang, Wen-Hung Hu | 2006-12-19 |
| 7129117 | Method of embedding semiconductor chip in support plate and embedded structure thereof | — | 2006-10-31 |
| 7112524 | Substrate for pre-soldering material and fabrication method thereof | Chu-Chin Hu | 2006-09-26 |
| 7089660 | Method of fabricating a circuit board | Chien-Chih Chen, Yi-San Wang | 2006-08-15 |
| 7081402 | Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same | Kun-Chen Tsai | 2006-07-25 |
| 7050304 | Heat sink structure with embedded electronic components for semiconductor package | Lin-Yin Wong | 2006-05-23 |
| 7012019 | Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same | Kun-Chen Tsai | 2006-03-14 |
| 6853084 | Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same | Chiang-Du Chen, Yen-Hung Liu | 2005-02-08 |
| 6649506 | Method of fabricating vias in solder pads of a ball grid array (BGA) substrate | — | 2003-11-18 |
| 6576540 | Method for fabricating substrate within a Ni/Au structure electroplated on electrical contact pads | Chiang-Du Chen, Yen-Hung Liu | 2003-06-10 |
| 6574863 | Thin core substrate for fabricating a build-up circuit board | I-Chung Tung, Han-Kun Hsieh | 2003-06-10 |
| 6543676 | Pin attachment by a surface mounting method for fabricating organic pin grid array packages | I-Chung Tung | 2003-04-08 |
| 6475327 | Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier | I-Chung Tung, Jiun-Shian Yu, Kuo-Bin Chen | 2002-11-05 |
| 6432748 | Substrate structure for semiconductor package and manufacturing method thereof | — | 2002-08-13 |