Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7098126 | Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints | Shing-Ru Wang, I-Chung Tung | 2006-08-29 |
| 6864586 | Padless high density circuit board | Wei-Feng Lin | 2005-03-08 |
| 6790758 | Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging | Wei-Feng Lin | 2004-09-14 |
| 6720246 | Flip chip assembly process for forming an underfill encapsulant | Wei-Feng Lin | 2004-04-13 |
| 6707677 | Chip-packaging substrate and test method therefor | Wei-Feng Lin, Yi-Chang Hsieh | 2004-03-16 |
| 6574863 | Thin core substrate for fabricating a build-up circuit board | I-Chung Tung, Shih-Ping Hsu | 2003-06-10 |