Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7098126 | Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints | Han-Kun Hsieh, Shing-Ru Wang | 2006-08-29 |
| 6910264 | Method for making a multilayer circuit board having embedded passive components | — | 2005-06-28 |
| 6574863 | Thin core substrate for fabricating a build-up circuit board | Han-Kun Hsieh, Shih-Ping Hsu | 2003-06-10 |
| 6543676 | Pin attachment by a surface mounting method for fabricating organic pin grid array packages | Shih-Ping Hsu | 2003-04-08 |
| 6475327 | Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier | Jiun-Shian Yu, Kuo-Bin Chen, Shih-Ping Hsu | 2002-11-05 |
| 5468429 | Ultrasound-enhanced devolatilization of thermoplastic plastics | Tzu-Li Li, Duncan Yu | 1995-11-21 |