Issued Patents All Time
Showing 101–125 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7881070 | Circuit board having power source | — | 2011-02-01 |
| 7863729 | Circuit board structure embedded with semiconductor chips | Chung-Cheng Lien, Shang-Wei Chen | 2011-01-04 |
| 7858885 | Circuit board structure | — | 2010-12-28 |
| 7839649 | Circuit board structure having embedded semiconductor element and fabrication method thereof | — | 2010-11-23 |
| 7839650 | Circuit board structure having embedded capacitor and fabrication method thereof | — | 2010-11-23 |
| 7820233 | Method for fabricating a flip chip substrate structure | Bo-Wei Chen, Hsien-Shou Wang | 2010-10-26 |
| 7817441 | Circuit board | — | 2010-10-19 |
| 7812460 | Packaging substrate and method for fabricating the same | — | 2010-10-12 |
| 7754538 | Packaging substrate structure with electronic components embedded therein and method for manufacturing the same | — | 2010-07-13 |
| 7719104 | Circuit board structure with embedded semiconductor chip and method for fabricating the same | Shang-Wei Chen | 2010-05-18 |
| 7718470 | Package substrate and method for fabricating the same | — | 2010-05-18 |
| 7705446 | Package structure having semiconductor chip embedded therein and method for fabricating the same | Kan-Jung Chia | 2010-04-27 |
| 7706148 | Stack structure of circuit boards embedded with semiconductor chips | Chung-Cheng Lien, Chia-Wei Chang | 2010-04-27 |
| 7659193 | Conductive structures for electrically conductive pads of circuit board and fabrication method thereof | Wen-Hung Hu, Ying-Tung Wang, Chao-Wen Shih | 2010-02-09 |
| 7656040 | Stack structure of circuit board with semiconductor component embedded therein | Chung-Cheng Lien, Chia-Wei Chang | 2010-02-02 |
| 7639473 | Circuit board structure with embedded electronic components | Kan-Jung Chia | 2009-12-29 |
| 7629204 | Surface roughening method for embedded semiconductor chip structure | — | 2009-12-08 |
| 7626270 | Coreless package substrate with conductive structures | Bo-Wei Chen, Hsien-Shou Wang | 2009-12-01 |
| 7614146 | Method for fabricating circuit board structure | — | 2009-11-10 |
| 7598610 | Plate structure having chip embedded therein and the manufacturing method of the same | Chung-Cheng Lien, Kan-Jung Chia, Shang-Wei Chen | 2009-10-06 |
| 7592706 | Multi-layer circuit board with fine pitches and fabricating method thereof | — | 2009-09-22 |
| 7582961 | Package structure with circuits directly connected to semiconductor chip | Kan-Jung Chia | 2009-09-01 |
| 7546682 | Methods for repairing circuit board having defective pre-soldering bump | Chao-Wen Shih | 2009-06-16 |
| 7544599 | Manufacturing method of solder ball disposing surface structure of package substrate | — | 2009-06-09 |
| 7539022 | Chip embedded packaging structure | — | 2009-05-26 |