Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8709940 | Structure of circuit board and method for fabricating the same | Shing-Ru Wang, Shih-Ping Hsu | 2014-04-29 |
| 7906850 | Structure of circuit board and method for fabricating same | Shing-Ru Wang, Shih-Ping Hsu | 2011-03-15 |
| 7867888 | Flip-chip package substrate and a method for fabricating the same | — | 2011-01-11 |
| 7820233 | Method for fabricating a flip chip substrate structure | Bo-Wei Chen, Shih-Ping Hsu | 2010-10-26 |
| 7626270 | Coreless package substrate with conductive structures | Bo-Wei Chen, Shih-Ping Hsu | 2009-12-01 |
| 7435618 | Method to manufacture a coreless packaging substrate | Bo-Wei Chen, Shih-Ping Hsu | 2008-10-14 |
| 7419850 | Method to manufacture a coreless packaging substrate | Bo-Wei Chen, Shih-Ping Hsu | 2008-09-02 |