Issued Patents All Time
Showing 51–75 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754982 | Packaging module and substrate structure thereof | Chun-Hsien Yu, Chu-Chin Hu | 2017-09-05 |
| 9750142 | Method for manufacturing an electronic package | — | 2017-08-29 |
| 9741646 | Package substrate and its fabrication method | Chin-Yao Hsu | 2017-08-22 |
| 9730328 | Printed circuit board with embedded component and method for manufacturing same | — | 2017-08-08 |
| 9711445 | Package substrate, package structure including the same, and their fabrication methods | Chun-Hsien Yu | 2017-07-18 |
| 9613894 | Electronic package | Chu-Chin Hu | 2017-04-04 |
| 9601402 | Package apparatus and manufacturing method thereof | E-Tung Chou, Chu-Chin Hu | 2017-03-21 |
| 9589935 | Package apparatus and manufacturing method thereof | Chu-Chin Hu, E-Tung Chou | 2017-03-07 |
| 9583436 | Package apparatus and manufacturing method thereof | Chao-Tsung Tseng, Chin-Ming Liu, Che-Wei Hsu | 2017-02-28 |
| 9548234 | Package substrate and flip-chip package circuit including the same | Che-Wei Hsu | 2017-01-17 |
| 9536864 | Package structure and its fabrication method | — | 2017-01-03 |
| 9484224 | Method of fabricating a circuit board structure | — | 2016-11-01 |
| 9370105 | Package apparatus with multiple pillar layers | Che-Wei Hsu | 2016-06-14 |
| 9357647 | Packaging substrate, method for manufacturing same, and chip packaging body having same | Chu-Chin Hu, E-Tung Chou, Chih-Jen Hsiao | 2016-05-31 |
| 9338900 | Interposer substrate and method of fabricating the same | Pao-Hung Chou, Che-Wei Hsu | 2016-05-10 |
| 9271388 | Interposer and package on package structure | — | 2016-02-23 |
| 9265146 | Method for manufacturing a multi-layer circuit board | Che-Wei Hsu | 2016-02-16 |
| 9232665 | Method of fabricating packaging substrate having a passive element embedded therein | Zhao-Chong Zeng | 2016-01-05 |
| 9214437 | Package method | Che-Wei Hsu | 2015-12-15 |
| 9179549 | Packaging substrate having embedded passive component and fabrication method thereof | Zhao-Chong Zeng | 2015-11-03 |
| 9099450 | Package structure and method for manufacturing same | — | 2015-08-04 |
| 9089082 | Printed circuit board with embedded component and method for manufacturing same | — | 2015-07-21 |
| 9024422 | Package structure having embedded semiconductor component and fabrication method thereof | I-Ta Tsai | 2015-05-05 |
| 9015936 | Method for manufacturing IC substrate | Che-Wei Hsu | 2015-04-28 |
| 9000573 | Package on package structure and method for manufacturing same | Chien-Chih Chen, Hong-Xia Shi | 2015-04-07 |