Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10219390 | Fabrication method of packaging substrate having embedded passive component | Shih-Pin Hsu | 2019-02-26 |
| 9295159 | Method for fabricating packaging substrate with embedded semiconductor component | — | 2016-03-22 |
| 9232665 | Method of fabricating packaging substrate having a passive element embedded therein | Shih-Ping Hsu | 2016-01-05 |
| 9179549 | Packaging substrate having embedded passive component and fabrication method thereof | Shih-Ping Hsu | 2015-11-03 |
| 9129870 | Package structure having embedded electronic component | — | 2015-09-08 |
| 8884429 | Package structure having embedded electronic component and fabrication method thereof | — | 2014-11-11 |
| 8829356 | Packaging substrate having a passive element embedded therein and method of fabricating the same | Shih-Ping Hsu | 2014-09-09 |
| 8421213 | Package structure | Shin-Ping Hsu, Zhi-Hui Yang | 2013-04-16 |
| 8242383 | Packaging substrate with embedded semiconductor component and method for fabricating the same | — | 2012-08-14 |
| 7948085 | Circuit board structure | Chao-Wen Shih | 2011-05-24 |
| 7763969 | Structure with semiconductor chips embeded therein | Shi-Ping Hsu | 2010-07-27 |
| 7554131 | Chip embedded package structure and fabrication method thereof | — | 2009-06-30 |