Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8164003 | Circuit board surface structure and fabrication method thereof | Ying-Tung Wang | 2012-04-24 |
| 7350298 | Method for fabricating circuit board with conductive structure | Shih-Ping Hsu, Ying-Tung Wang, Wen-Hung Hu, Chao-Wen Shih | 2008-04-01 |
| 7341934 | Method for fabricating conductive bump of circuit board | Shih-Ping Hsu, Ying-Tung Wang, Wen-Hung Hu, Chao-Wen Shih, Meng-Da Chou | 2008-03-11 |
| 7253364 | Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the same | Shing-Ru Wang | 2007-08-07 |
| 7174630 | Method for fabricating connection terminal of circuit board | Shih-Ping Hsu, Chao-Wen Shih | 2007-02-13 |
| 7151050 | Method for fabricating electrical connection structure of circuit board | Shih-Ping Hsu, Chao-Wen Shih, Ying-Tung Wang, Wen-Hung Hu | 2006-12-19 |