Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417581 | Package structure | Shih-Ping Hsu, Chin-Wen Liu, Shu-Wei Hu | 2022-08-16 |
| 10079190 | Methods of fabricating an electronic package structure | Shih-Ping Hsu, Chin-Wen Liu, Shu-Wei Hu | 2018-09-18 |