Issued Patents All Time
Showing 101–125 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613996 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2017-04-04 |
| 9576999 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2017-02-21 |
| 9559244 | CMOS image sensors and methods for forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu | 2017-01-31 |
| 9536777 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +2 more | 2017-01-03 |
| 9525003 | Structure and method for 3D image sensor | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2016-12-20 |
| 9406715 | Image sensor device | Szu-Ying Chen, Jen-Cheng Liu, Feng-Chi Hung, Dun-Nian Yaung | 2016-08-02 |
| 9401380 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2016-07-26 |
| 9391114 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Jeng-Shyan Lin, Chun-Ming Su +1 more | 2016-07-12 |
| 9373657 | System and method for fabricating a 3D image sensor structure | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2016-06-21 |
| 9356066 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2016-05-31 |
| 9356058 | Backside structure for BSI image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2016-05-31 |
| 9355888 | Implant isolated devices and method for forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2016-05-31 |
| 9312294 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2016-04-12 |
| 9305966 | Backside structure and method for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2016-04-05 |
| 9293502 | Semiconductor switching device separated by device isolation | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2016-03-22 |
| 9287312 | Imaging sensor structure and method | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shu-Ting Tsai +3 more | 2016-03-15 |
| 9281334 | Pickup device structure within a device isolation region | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2016-03-08 |
| 9263272 | Gate electrodes with notches and methods for forming the same | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2016-02-16 |
| 9245912 | Method and apparatus for low resistance image sensor contact | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chun-Chieh Chuang, Shuang-Ji Tsai +1 more | 2016-01-26 |
| 9177986 | Isolation for semiconductor devices | Wen-I Hsu, Jen-Cheng Liu, Dun-Nian Yaung, Tzu-Hsuan Hsu, Wen-De Wang | 2015-11-03 |
| 9147703 | CMOS image sensor structure | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Wen-De Wang | 2015-09-29 |
| 9076708 | CMOS image sensors and methods for forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu | 2015-07-07 |
| 9059061 | Structure and method for 3D image sensor | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2015-06-16 |
| 9048162 | CMOS image sensors and methods for forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu | 2015-06-02 |
| 9006080 | Varied STI liners for isolation structures in image sensing devices | Cheng-Hsien Chou, Feng-Chi Hung, Shih Pei Chou, Jiech-Fun Lu, Yeur-Luen Tu +1 more | 2015-04-14 |