Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154939 | High capacitance MIM device with self aligned spacer | Dun-Nian Yaung, Yu-Cheng Tsai, Meng-Hsien Lin, Ching-Chung Su, Jen-Cheng Liu +2 more | 2024-11-26 |
| 12132039 | Mask transfer method (and related apparatus) for a bumping process | Chern-Yow Hsu | 2024-10-29 |
| 12087826 | Method for forming a semiconductor structure | Yao-Wen Chang, Gung-Pei Chang, Chern-Yow Hsu | 2024-09-10 |
| 11769791 | High capacitance MIM device with self aligned spacer | Dun-Nian Yaung, Yu-Cheng Tsai, Meng-Hsien Lin, Ching-Chung Su, Jen-Cheng Liu +2 more | 2023-09-26 |
| 11735550 | Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion | Chern-Yow Hsu | 2023-08-22 |
| 11721683 | Mask transfer method (and related apparatus) for a bumping process | Chern-Yow Hsu | 2023-08-08 |
| 11476337 | Method for forming a semiconductor structure | Yao-Wen Chang, Gung-Pei Chang, Chern-Yow Hsu | 2022-10-18 |
| 11264368 | Mask transfer method (and related apparatus) for a bumping process | Chern-Yow Hsu | 2022-03-01 |
| 11211352 | Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion | Chern-Yow Hsu | 2021-12-28 |
| 10790362 | Semiconductor structure and manufacturing method of the same | Yao-Wen Chang, Gung-Pei Chang, Chern-Yow Hsu | 2020-09-29 |
| 9793339 | Method for preventing copper contamination in metal-insulator-metal (MIM) capacitors | Chern-Yow Hsu, Shih-Chang Liu | 2017-10-17 |
| 9257498 | Process to improve performance for metal-insulator-metal (MIM) capacitors | Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai | 2016-02-09 |