Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424577 | Isolation structure for bond pad structure | Jeng-Shyan Lin, Shih Pei Chou, Tzu-Hsuan Hsu | 2025-09-23 |
| 12400984 | Isolation structure for bond pad structure | Jeng-Shyan Lin, Shih Pei Chou, Tzu-Hsuan Hsu | 2025-08-26 |
| 12396272 | Stilted pad structure | Hung-Ling Shih, Kuo-Ming Wu, Hung-Wen Hsu | 2025-08-19 |
| 12300670 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2025-05-13 |
| 11894410 | Bond pad structure for bonding improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2024-02-06 |
| 11804473 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2023-10-31 |
| 11694979 | Isolation structure for bond pad structure | Jeng-Shyan Lin, Shih Pei Chou, Tzu-Hsuan Hsu | 2023-07-04 |
| 11457094 | Network system and conversion apparatus crossing different transmission protocols | Po-Han Peng | 2022-09-27 |
| 11335716 | Photosensing pixel, image sensor and method of fabricating the same | Feng-Chi Hung, Chen-Hsien Lin, Tzu-Hsuan Hsu, Yan-Chih Lu | 2022-05-17 |
| 11282802 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2022-03-22 |
| 11244981 | Bond pad structure for bonding improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2022-02-08 |
| 11069736 | Via support structure under pad areas for BSI bondability improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2021-07-20 |
| 11024602 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2021-06-01 |
| 10991667 | Isolation structure for bond pad structure | Jeng-Shyan Lin, Shih Pei Chou, Tzu-Hsuan Hsu | 2021-04-27 |
| 10566374 | Via support structure under pad areas for BSI bondability improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2020-02-18 |
| 10515995 | Bond pad structure for bonding improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2019-12-24 |
| 10475758 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2019-11-12 |
| 10283549 | Via support structure under pad areas for BSI bondability improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2019-05-07 |
| 10269770 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2019-04-23 |
| 10038026 | Bond pad structure for bonding improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2018-07-31 |
| 10038025 | Via support structure under pad areas for BSI bondability improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2018-07-31 |
| 9881884 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2018-01-30 |
| 9704827 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2017-07-11 |