Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894410 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou | 2024-02-06 |
| 11342373 | Manufacturing method of image sensing device | Wei Chuang Wu, Feng-Chi Hung, Ching-Chun Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2022-05-24 |
| 11244981 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou | 2022-02-08 |
| 10622394 | Image sensing device | Wei Chuang Wu, Feng-Chi Hung, Ching-Chun Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2020-04-14 |
| 10515995 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou | 2019-12-24 |
| 10304889 | Image sensor device and manufacturing method thereof | Wei Chuang Wu, Feng-Chi Hung, Jen-Cheng Liu, Ching-Chun Wang | 2019-05-28 |
| 10074680 | Image sensor with low step height between back-side metal and pixel array | Chien-Hsien Tseng, Nai-Wen Cheng, Shou-Gwo Wuu, Tung-Ting Wu | 2018-09-11 |
| 10038026 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou | 2018-07-31 |
| 9536810 | Flat pad structure for integrating complementary metal-oxide-semiconductor (CMOS) image sensor processes | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Hsiao-Hui Tseng +2 more | 2017-01-03 |
| 9299740 | Image sensor with low step height between back-side metal and pixel array | Chien-Hsien Tseng, Nai-Wen Cheng, Shou-Gwo Wuu, Tung-Ting Wu | 2016-03-29 |
| 8816422 | Multi-trapping layer flash memory cell | Tong-Chern Ong | 2014-08-26 |
| 8735963 | Flash memory cells having leakage-inhibition layers | Tong-Chern Ong, Albert Chin, Hsueh-Jen Yang | 2014-05-27 |
| 8294197 | Program/erase schemes for floating gate memory cells | Tong-Chern Ong | 2012-10-23 |
| 8212233 | Forming phase-change memory using self-aligned contact/via scheme | Chien-Chih Chiu, Tsun-Kai Tsao, Chi-Hsin Lo | 2012-07-03 |
| 7968967 | One-time-programmable anti-fuse formed using damascene process | Tong-Chern Ong | 2011-06-28 |
| 7966090 | Automated material handling system and method | Nain-Sung Lee, Chia-Chin Hsu | 2011-06-21 |
| 7579646 | Flash memory with deep quantum well and high-K dielectric | Tong-Chern Ong, Albert Chin, Chun-Hung Lai | 2009-08-25 |
| 7533373 | Method for prevention of system execution malfunction | Chien-Fei Cheng | 2009-05-12 |
| 7316240 | Exhaust system and mini-exhaust static pressure controlling apparatus thereof | Po-Sung Kuo, Yung-Dar Chen, Dar-Rung Kuo, Ming-Chien Wen | 2008-01-08 |
| 7058469 | System and method for fully automatic manufacturing control in a furnace area of a semiconductor foundry | Tsean Chou, Larry Jann | 2006-06-06 |
| 6778879 | Automated material handling system and method of use | Ko-Pin Chang, Jui-An Shih, Jim Chue, Jason Liu | 2004-08-17 |
| 6687563 | Integration method of dispatch and schedule tools for 300 mm full automation Fab | Jim Chue, Ray Shih, Eric Chang, Jason Liu | 2004-02-03 |
| 6660125 | Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue) | Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen | 2003-12-09 |
| 6566263 | Method of forming an HDP CVD oxide layer over a metal line structure for high aspect ratio design rule | Mong-Chi Hung, Teh-Wei Ger | 2003-05-20 |
| 6541370 | Composite microelectronic dielectric layer with inhibited crack susceptibility | Shi-Wei Wang, Shin-Kai Chen | 2003-04-01 |