Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660125 | Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue) | Ming-Tsong Wang, Chung-En Kao, Kuang-Hsing Liu | 2003-12-09 |
| 6358851 | Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue) | Ming-Tsong Wang, Chung-En Kao, Kuang-Hsing Liu | 2002-03-19 |