Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6537919 | Process to remove micro-scratches | — | 2003-03-25 |
| 6358851 | Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue) | Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen | 2002-03-19 |
| 6244936 | Method and device for reducing semiconductor defects caused by wafer clamping | Tsung-En Kao | 2001-06-12 |