Issued Patents All Time
Showing 51–75 of 133 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304889 | Image sensor device and manufacturing method thereof | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Jen-Cheng Liu | 2019-05-28 |
| 10297631 | Metal block and bond pad structure | Cheng-Ying Ho, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu | 2019-05-21 |
| 10283549 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung | 2019-05-07 |
| 10276618 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2019-04-30 |
| 10269858 | Image sensor with reduced optical path | Shyh-Fann Ting, Chen-Jong Wang, Jhy-Jyi Sze, Chun-Ming Su, Wei Chuang Wu +1 more | 2019-04-23 |
| 10269840 | Image sensing device and manufacturing method thereof | Feng-Chi Hung, Jen-Cheng Liu, Tse-Hua Lu | 2019-04-23 |
| 10269770 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2019-04-23 |
| 10269857 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Yen-Chang Chu, Shyh-Fann Ting | 2019-04-23 |
| 10163878 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2018-12-25 |
| 10163758 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2018-12-25 |
| 10147752 | Back-side illuminated (BSI) image sensor with global shutter scheme | Chun-Yuan Chen, Dun-Nian Yaung, Shyh-Fann Ting, Wei Chuang Wu, Yen-Ting Chiang +1 more | 2018-12-04 |
| 10121821 | Biased backside illuminated sensor shield structure | Shyh-Fann Ting, Feng-Chi Hung, Jhy-Jyi Sze, Dun-Nian Yaung | 2018-11-06 |
| 10103287 | Semiconductor arrangement and formation thereof | Kai-Chun Hsu, Shyh-Fann Ting, Jhy-Jyi Sze, Chun-Tsung Kuo, Dun-Nian Yaung | 2018-10-16 |
| 10074612 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2018-09-11 |
| 10062720 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Dun-Nian Yaung, Hsiao-Hui Tseng, Chih-Hui Huang, Shyh-Fann Ting +2 more | 2018-08-28 |
| 10038026 | Bond pad structure for bonding improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2018-07-31 |
| 10038025 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung | 2018-07-31 |
| 10014340 | Stacked SPAD image sensor | Ming-Hsien Yang, Dun-Nian Yaung, Feng-Chi Hung, Shyh-Fann Ting, Chun-Yuan Chen | 2018-07-03 |
| 9978791 | Image sensor and method for manufacturing the same | Tse-Hua Lu, Jhy-Jyi Sze, Ping-Fang Hung | 2018-05-22 |
| 9966412 | Method for reducing optical cross-talk in image sensors | Chin-Min Lin, Dun-Nian Yaung, Chun-Ming Su, Tzu-Hsuan Hsu | 2018-05-08 |
| 9954022 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2018-04-24 |
| 9917130 | Image sensor with reduced optical path | Shyh-Fann Ting, Chen-Jong Wang, Jhy-Jyi Sze, Chun-Ming Su, Wei Chuang Wu +1 more | 2018-03-13 |
| 9917132 | CMOS image sensor structure with IR/NIR integration | Tsung-Han Tsai, Kun-Huei Lin, Chun-Hao Chou, Tzu-Hsuan Hsu, Kuo-Cheng Lee +1 more | 2018-03-13 |
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou +4 more | 2018-02-06 |
| 9881884 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Dun-Nian Yaung, Feng-Chi Hung, Sin-Yao Huang | 2018-01-30 |