Issued Patents All Time
Showing 26–50 of 133 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222915 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting | 2022-01-11 |
| 11088192 | Metal block and bond pad structure | Cheng-Ying Ho, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu | 2021-08-10 |
| 11088196 | Metal reflector grounding for noise reduction in light detector | Yen-Ting Chiang, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +1 more | 2021-08-10 |
| 11069736 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung | 2021-07-20 |
| 11069731 | Apparatus for reducing optical cross-talk in image sensors | Chin-Min Lin, Dun-Nian Yaung, Chun-Ming Su, Tzu-Hsuan Hsu | 2021-07-20 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2021-06-01 |
| 10943940 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Yen-Chang Chu, Shyh-Fann Ting | 2021-03-09 |
| 10868050 | Backside illuminated image sensor with negatively charged layer | Shyh-Fann Ting, Chih-Yu Lai, Cheng-Ta Wu, Yeur-Luen Tu | 2020-12-15 |
| 10861894 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-12-08 |
| 10833119 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting | 2020-11-10 |
| 10811398 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2020-10-20 |
| 10804155 | Inductor structure for integrated circuit | Shih-Han Huang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2020-10-13 |
| 10790194 | Inductor structure for integrated circuit | Shih-Han Huang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2020-09-29 |
| 10727164 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2020-07-28 |
| 10727265 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-07-28 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2020-07-28 |
| 10622394 | Image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Jen-Cheng Liu, Dun-Nian Yaung | 2020-04-14 |
| 10566374 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung | 2020-02-18 |
| 10522586 | Apparatus for reducing optical cross-talk in image sensors | Chin-Min Lin, Dun-Nian Yaung, Chun-Ming Su, Tzu-Hsuan Hsu | 2019-12-31 |
| 10515995 | Bond pad structure for bonding improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2019-12-24 |
| 10510789 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2019-12-17 |
| 10504784 | Inductor structure for integrated circuit | Shih-Han Huang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2019-12-10 |
| 10490580 | Image sensor pickup region layout | Dun-Nian Yaung, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu | 2019-11-26 |
| 10475758 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Dun-Nian Yaung, Feng-Chi Hung, Sin-Yao Huang | 2019-11-12 |
| 10461109 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2019-10-29 |