Issued Patents All Time
Showing 76–100 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9142586 | Pad design for backside illuminated image sensor | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2015-09-22 |
| 9136298 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2015-09-15 |
| 9123615 | Vertically integrated image sensor chips and methods for forming the same | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2015-09-01 |
| 9059061 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2015-06-16 |
| 9041206 | Interconnect structure and method | Shu-Ting Tsai, Dun-Nian Yaung, Cheng-Jong Wang, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2015-05-26 |
| 9035445 | Seal ring structure with a metal pad | Dun-Nian Yaung, Jen-Cheng Liu, Hsin-Hui Lee, Wen-De Wang, Shu-Ting Tsai | 2015-05-19 |
| 9013022 | Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2015-04-21 |
| 8987855 | Pad structures formed in double openings in dielectric layers | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2015-03-24 |
| 8952497 | Scribe lines in wafers | U-Ting Chen, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shuang-Ji Tsai | 2015-02-10 |
| 8946849 | BSI image sensor chips with separated color filters and methods for forming the same | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2015-02-03 |
| 8941204 | Apparatus and method for reducing cross talk in image sensors | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Shuang-Ji Tsai, Min-Feng Kao | 2015-01-27 |
| 8895349 | Backside illuminated image sensor having capacitor on pixel region | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang | 2014-11-25 |
| 8810700 | Front side implanted guard ring structure for backside | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2014-08-19 |
| 8766387 | Vertically integrated image sensor chips and methods for forming the same | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2014-07-01 |
| 8736006 | Backside structure for a BSI image sensor device | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chun-Chieh Chuang +1 more | 2014-05-27 |
| 8710612 | Semiconductor device having a bonding pad and shield structure of different thickness | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Cheng-Ying Ho | 2014-04-29 |
| 8674467 | Image sensor and method of fabricating same | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2014-03-18 |
| 8664736 | Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Yueh-Chiou Lin | 2014-03-04 |
| 8604405 | Backside illuminated image sensor device with refractive index dependent layer thicknesses and method of forming the same | Han-Chi Liu, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Chun-Chieh Chuang | 2013-12-10 |
| 8569807 | Backside illuminated image sensor having capacitor on pixel region | Chun-Chieh Chuang, Dun-Nian Yuang, Jen-Cheng Liu, Wen-De Wang | 2013-10-29 |
| 8531565 | Front side implanted guard ring structure for backside illuminated image sensor | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2013-09-10 |
| 8502389 | CMOS image sensor and method for forming the same | Cheng-Ying Ho, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shih Pei Chou | 2013-08-06 |
| 8435824 | Backside illumination sensor having a bonding pad structure and method of making the same | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Yueh-Chiou Lin | 2013-05-07 |
| 8338917 | Multiple seal ring structure | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shu-Ting Tsai | 2012-12-25 |
| 8283754 | Seal ring structure with metal pad | Dun-Nian Yaung, Jen-Cheng Liu, Hsin-Hui Lee, Wen-De Wang, Shu-Ting Tsai | 2012-10-09 |