Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157959 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2018-12-18 |
| 10096515 | Interconnect structure for stacked device | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2018-10-09 |
| 10092768 | Interconnect structure and method of forming same | Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2018-10-09 |
| 10056353 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Chia-Chieh Lin, U-Ting Chen | 2018-08-21 |
| 9941320 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2018-04-10 |
| 9941249 | Multi-wafer stacking by Ox-Ox bonding | Szu-Ying Chen, Jeng-Shyan Lin, Tzu-Hsuan Hsu, Feng-Chi Hung, Dun-Nian Yaung | 2018-04-10 |
| 9917121 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Hsiu-Yu Cheng | 2018-03-13 |
| 9865645 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2018-01-09 |
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2017-11-07 |
| 9812409 | Seal ring structure with a metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsin-Hui Lee, Wen-De Wang | 2017-11-07 |
| 9764153 | Interconnect structure and method of forming same | Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2017-09-19 |
| 9754925 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2017-09-05 |
| 9748304 | Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods | U-Ting Chen, Szu-Ying Chen, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2017-08-29 |
| 9553020 | Interconnect structure for connecting dies and methods of forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2017-01-24 |
| 9543257 | 3DIC interconnect devices and methods of forming same | Jeng-Shyan Lin, Dun-Nian Yaung | 2017-01-10 |
| 9536777 | Interconnect apparatus and method | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2017-01-03 |
| 9536920 | Stacked image sensor having a barrier layer | U-Ting Chen, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2017-01-03 |
| 9525003 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2016-12-20 |
| 9455158 | 3DIC interconnect devices and methods of forming same | Szu-Ying Chen, Jeng-Shyan Lin, Tzu-Hsuan Hsu, Feng-Chi Hung, Dun-Nian Yaung | 2016-09-27 |
| 9412719 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2016-08-09 |
| 9406712 | Interconnect structure for connecting dies and methods of forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2016-08-02 |
| 9356066 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2016-05-31 |
| 9293392 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Lin Chia-Chieh +4 more | 2016-03-22 |
| 9287312 | Imaging sensor structure and method | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2016-03-15 |
| 9147702 | Image sensor for mitigating dark current | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Shuang-Ji Tsai | 2015-09-29 |