Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12409529 | Vacuum assembly for chemical mechanical polishing | Yu-Chen Wei, Chih-Yuan Yang, Jen-Chieh LAI, Szu-Cheng Wang, Chun-Jui Chu | 2025-09-09 |
| 12154608 | Magnetic tunnel junction device and method of forming same | Bo-Jhih Shen, Kuang-I Liu, Joung-Wei Liou, Jinn-Kwei Liang, Yi-Wei Chiu +4 more | 2024-11-26 |
| 12076831 | Chemical mechanical polishing apparatus and method | Yu-Chen Wei, Jheng-Si SU, Jen-Chieh LAI, Chun-Chieh Chan | 2024-09-03 |
| 12009222 | Method for forming semiconductor device structure | Yu-Chen Wei, Chun-Chieh Chan, Chun-Jui Chu, Jen-Chieh LAI | 2024-06-11 |
| 11990167 | Magnetic tunnel junction device and method of forming same | Bo-Jhih Shen, Kuang-I Liu, Joung-Wei Liou, Jinn-Kwei Liang, Yi-Wei Chiu +4 more | 2024-05-21 |
| 11685015 | Method and system for performing chemical mechanical polishing | Chih-Yuan Yang, Huai-Tei Yang, Yu-Chen Wei, Szu-Cheng Wang, Li-Hsiang Chao +1 more | 2023-06-27 |
| 11673223 | Chemical mechanical polishing method | Yu-Chen Wei, Jheng-Si SU, Jen-Chieh LAI, Chun-Chieh Chan | 2023-06-13 |
| 11292101 | Chemical mechanical polishing apparatus and method | Yu-Chen Wei, Jheng-Si SU, Jen-Chieh LAI, Chun-Chieh Chan | 2022-04-05 |
| 11251063 | Article transporter in semiconductor fabrication | Jheng-Si SU, Yu-Chen Wei, Chih-Yuan Yang, Jen-Chieh LAI | 2022-02-15 |
| 11239092 | Method for forming semiconductor device structure | Yu-Chen Wei, Chun-Chieh Chan, Chun-Jui Chu, Jen-Chieh LAI | 2022-02-01 |
| 11094554 | Polishing process for forming semiconductor device structure | Jen-Chieh LAI, Jheng-Si SU, Zhi-Sheng Hsu, Po-ting Huang | 2021-08-17 |
| 11043251 | Magnetic tunnel junction device and method of forming same | Bo-Jhih Shen, Kuang-I Liu, Joung-Wei Liou, Jinn-Kwei Liang, Yi-Wei Chiu +4 more | 2021-06-22 |
| 10843307 | Vacuum assembly for chemical mechanical polishing | Yu-Chen Wei, Chih-Yuan Yang, Jen-Chieh LAI, Szu-Cheng Wang, Chun-Jui Chu | 2020-11-24 |
| 10804133 | Article transferring method in semiconductor fabrication | Jheng-Si SU, Yu-Chen Wei, Chih-Yuan Yang, Jen-Chieh LAI | 2020-10-13 |
| 10636673 | Method for forming semiconductor device structure | Yu-Chen Wei, Chun-Chieh Chan, Chun-Jui Chu, Jen-Chieh LAI | 2020-04-28 |
| 10170343 | Post-CMP cleaning apparatus and method with brush self-cleaning function | Yu-Chen Wei, Chun-Jui Chu, Chun-Chieh Chan, Jen-Chieh LAI | 2019-01-01 |
| 9502290 | Oxidation-free copper metallization process using in-situ baking | Yu-Sheng Wang, Kei-Wei Chen, Szu-An Wu, Ying-Lang Wang | 2016-11-22 |
| 8587649 | Lane departure warning system | Chih-Wei Lo, Hui-Chen Wei | 2013-11-19 |
| 8470390 | Oxidation-free copper metallization process using in-situ baking | Yu-Sheng Wang, Kei-Wei Chen, Szu-An Wu, Ying-Lang Wang | 2013-06-25 |
| 8099861 | Current-leveling electroplating/electropolishing electrode | Shih-Chieh Chang, Ying-Lang Wang, Kei-Wei Chen, Chun-Chang Chen | 2012-01-24 |
| 7803257 | Current-leveling electroplating/electropolishing electrode | Shih-Chieh Chang, Ying-Lang Wang, Kei-Wei Chen, Chun-Chang Chen | 2010-09-28 |
| 7312149 | Copper plating of semiconductor devices using single intermediate low power immersion step | Chao-Lung Chen, Kei-Wei Chen, Ying-Lang Wang, Yu-Ku Lin, Ching-Hwanq Su +2 more | 2007-12-25 |
| 7304728 | Test device and method for laser alignment calibration | Shih-Tzung Chang, Yu-Ku Lin, Kei-Wei Chen, Ting-Chun Wang, Ching-Hwan Su +1 more | 2007-12-04 |
| 7128821 | Electropolishing method for removing particles from wafer surface | Chung-Chang Chen, Kei-Wei Chen, Shih-Tzung Chang, Chao-Lung Chen, Po-Jen Shih +2 more | 2006-10-31 |
| 7071100 | Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process | Kei-Wei Chen, Jung-Chih Tsao, Chi-Wen Liu, Jchung-Chang Chen, Shih-Tzung Chang +2 more | 2006-07-04 |