Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255150 | CMP safe alignment mark | Huang-Jen Hsu, Kung-Ming Liu, Tzuyi Hsieh, Feng-Inn Wu | 2025-03-18 |
| 12076831 | Chemical mechanical polishing apparatus and method | Yu-Chen Wei, Shih-Ho Lin, Jen-Chieh LAI, Chun-Chieh Chan | 2024-09-03 |
| 11673223 | Chemical mechanical polishing method | Yu-Chen Wei, Shih-Ho Lin, Jen-Chieh LAI, Chun-Chieh Chan | 2023-06-13 |
| 11292101 | Chemical mechanical polishing apparatus and method | Yu-Chen Wei, Shih-Ho Lin, Jen-Chieh LAI, Chun-Chieh Chan | 2022-04-05 |
| 11251063 | Article transporter in semiconductor fabrication | Yu-Chen Wei, Chih-Yuan Yang, Shih-Ho Lin, Jen-Chieh LAI | 2022-02-15 |
| 11094554 | Polishing process for forming semiconductor device structure | Shih-Ho Lin, Jen-Chieh LAI, Zhi-Sheng Hsu, Po-ting Huang | 2021-08-17 |
| 10804133 | Article transferring method in semiconductor fabrication | Yu-Chen Wei, Chih-Yuan Yang, Shih-Ho Lin, Jen-Chieh LAI | 2020-10-13 |