Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255150 | CMP safe alignment mark | Huang-Jen Hsu, Jheng-Si SU, Kung-Ming Liu, Tzuyi Hsieh | 2025-03-18 |
| 12193212 | Method of forming semiconductor device and semiconductor device | Sangyeol PARK | 2025-01-07 |
| 12128522 | Polishing head, chemical-mechanical polishing system and method for polishing substrate | Shu-Bin Hsu, Ren-Guei Lin, Sheng-Chen Wang, Jung-Yu Li | 2024-10-29 |
| 12116891 | Calculation method for mobile fluid saturation after reservoir fracturing based on netting analysis | Chunchao Chen, Ao Wang, Yujing Long, Siyuan Chen, Yingying Luo | 2024-10-15 |
| 12060385 | Compounds for RNA capping and uses thereof | Jiancun Zhang, Lijun Zhang, Yiqian ZHOU, Jiafeng CHEN, Jufu Zhang +9 more | 2024-08-13 |
| 11984324 | Method of manufacturing a semiconductor device and a semiconductor device | Yu-Chen Wei, Tzi-Yi Shieh | 2024-05-14 |
| 11631886 | Quasi-solid-state electrolyte based on ionic liquid for use in lithium battery and preparation method thereof | Renjie Chen, Nan Chen, Lili Wang, Yujuan Dai | 2023-04-18 |
| 11622488 | Semiconductor structure and manufacturing method thereof | Sang Yeol Park | 2023-04-04 |
| 11407083 | Polishing head, chemical-mechanical polishing system and method for polishing substrate | Shu-Bin Hsu, Ren-Guei Lin, Sheng-Chen Wang, Jung-Yu Li | 2022-08-09 |
| 10328549 | Polishing head, chemical-mechanical polishing system and method for polishing substrate | Shu-Bin Hsu, Ren-Guei Lin, Sheng-Chen Wang, Jung-Yu Li | 2019-06-25 |
| 9908213 | Method of CMP pad conditioning | Hsiu-Ming Yeh | 2018-03-06 |
| 9768080 | Semiconductor manufacturing apparatus and method thereof | Jia-Jhen Chen, Sheng-Chen Wang | 2017-09-19 |
| 9481069 | Chemical mechanical polishing apparatus and polishing method using the same | Yuan-Hsuan Chen, Sheng-Chen Wang | 2016-11-01 |
| 9418904 | Localized CMP to improve wafer planarization | Sheng-Chen Wang | 2016-08-16 |
| 9382480 | Dichromatic dye composition and application thereof | Haibin Xu, Yudong Tan, Zhaoyuan Chen, Xiaofei She, Da Huang +3 more | 2016-07-05 |
| 9255107 | Heteroaryl alkyne compound and use thereof | Yong Wang, Liwen ZHAO, Di Zhang, Sheng Bi, Yiping Gao +5 more | 2016-02-09 |
| 9149906 | Apparatus for CMP pad conditioning | Hsiu-Ming Yeh | 2015-10-06 |
| 8992287 | Slurry supply system for CMP process | Sheng-Chen Wang, Chih-Hung Tsai, Huang-Jen Hsu, Te-Chia Hsu | 2015-03-31 |
| 8939815 | Systems providing an air zone for a chucking stage | Hui-Ting Tsai | 2015-01-27 |
| 6664189 | Removal of wafer edge defocus due to CMP | Kuang-Hung Lin | 2003-12-16 |