Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12227865 | Plating apparatus and method for electroplating wafer | Che-Min Lin, Hung-San Lu, Chao-Yuan Chang, Chun-An Kung, Chin-Hsin Hsiao +3 more | 2025-02-18 |
| 12051659 | Semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Po-Han Wang, Ing-Ju Lee, Cheng-Ming Wu | 2024-07-30 |
| 11688703 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Po-Han Wang, Ing-Ju Lee, Cheng-Ming Wu | 2023-06-27 |
| 11401624 | Plating apparatus and method for electroplating wafer | Che-Min Lin, Hung-San Lu, Chao-Yuan Chang, Chun-An Kung, Chin-Hsin Hsiao +3 more | 2022-08-02 |
| 11309265 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Po-Han Wang, Ing-Ju Lee, Cheng-Ming Wu | 2022-04-19 |
| 7312149 | Copper plating of semiconductor devices using single intermediate low power immersion step | Kei-Wei Chen, Shih-Ho Lin, Ying-Lang Wang, Yu-Ku Lin, Ching-Hwanq Su +2 more | 2007-12-25 |
| 7128821 | Electropolishing method for removing particles from wafer surface | Shih-Ho Lin, Chung-Chang Chen, Kei-Wei Chen, Shih-Tzung Chang, Po-Jen Shih +2 more | 2006-10-31 |