Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8519064 | Encapsulated material composition | Reui Hong Gao, Mao Ping Lee, Jui Jung Wu | 2013-08-27 |
| 7067896 | Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture | Yi-Lang Wu, Lin-June Wu, Dian-Hau Chen | 2006-06-27 |
| 6861376 | Photoresist scum free process for via first dual damascene process | Dian-Hau Chen, Ruei-Je Shiu | 2005-03-01 |
| 6221747 | Method of fabricating a conductive plug with a low junction resistance in an integrated circuit | Kuen-Chu Chen, Weng-Yi Chen | 2001-04-24 |