Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6861376 | Photoresist scum free process for via first dual damascene process | Dian-Hau Chen, Juei-Kuo Wu | 2005-03-01 |
| 6489216 | Chemical mechanical polish (CMP) planarizing method employing topographic mark preservation | Dian-Hau Chen | 2002-12-03 |