Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9807315 | Lookup table interpolation in a film emulation camera system | Zachary Daniel Hodges, Rohit Patil | 2017-10-31 |
| 9681064 | Lookup table interpolation in a film emulation camera system | Zachary Daniel Hodges, Rohit Patil | 2017-06-13 |
| 9602739 | Lookup table interpolation in a film emulation camera system | Zachary Daniel Hodges, Rohit Patil | 2017-03-21 |
| 8146043 | Huygens' box methodology for signal integrity analysis | Lijun Jiang, Jason D. Morsey, Barry J. Rubin, Weng C. Chew, Mao-kun Li | 2012-03-27 |
| 7759797 | Bonding pad structure to minimize IMD cracking | Chung-Shi Liu, Ruey-Yun Shiue | 2010-07-20 |
| 7707527 | Huygens' box methodology for signal integrity analysis | Lijun Jiang, Jason D. Morsey, Barry J. Rubin, Weng C. Chew, Mao-Kin Li | 2010-04-27 |
| 7135395 | Bonding pad structure to minimize IMD cracking | Chung Liu, Ruey-Yun Shiue | 2006-11-14 |
| 6875682 | Mesh pad structure to eliminate IMD crack on pad | Chung-Shi Liu, Ruey-Yun Shiue | 2005-04-05 |
| 6638867 | Method for forming a top interconnection level and bonding pads on an integrated circuit chip | Meng-Chang Liu | 2003-10-28 |
| 6358831 | Method for forming a top interconnection level and bonding pads on an integrated circuit chip | Meng-Chang Liu | 2002-03-19 |
| 5705441 | Ion implant silicon nitride mask for a silicide free contact region in a self aligned silicide process | Jau-Jey Wang | 1998-01-06 |