Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5923088 | Bond pad structure for the via plug process | Ruey-Yun Shiue, Wen-Teng Wu, Chin-Kai Liu | 1999-07-13 |
| 5712207 | Profile improvement of a metal interconnect structure on a tungsten plug | Chung-Kuang Lee, Pin-Nan Tseng | 1998-01-27 |
| 5700735 | Method of forming bond pad structure for the via plug process | Ruey-Yun Shiue, Wen-Teng Wu, Chin-Kai Liu | 1997-12-23 |
| 5547881 | Method of forming a resistor for ESD protection in a self aligned silicide process | Jau-Jey Wang, Pin-Nan Tseng | 1996-08-20 |