Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183709 | Chip package structure with ring-like structure | Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2024-12-31 |
| 11848302 | Chip package structure with ring-like structure | Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-12-19 |
| 11545463 | Chip package structure with ring-like structure | Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-01-03 |
| 11198984 | Underwater repair system for cavity region of concrete panel rock-fill dam panel | Yingli Wu, Ruiji Yi, Wanli GUO, Denghua Li, Limin Xiao +22 more | 2021-12-14 |
| 11088108 | Chip package structure including ring-like structure and method for forming the same | Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2021-08-10 |