Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12476178 | Reduction of cracks in redistribution structure | Tien-En Kuo, Li-Hsien Huang, Tien-Chung Yang, Yao-Chun Chuang, Jun He | 2025-11-18 |
| 12469807 | Fan-out package structures with cascaded openings in enhancement layer | Tien-En Kuo, Li-Hsien Huang, Tien-Chung Yang, Yao-Chun Chuang, Jun He | 2025-11-11 |