Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7220674 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Thomas Marieb, Paul McGregor, Shu Jin | 2007-05-22 | $18,006,000 |
| 6977220 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Thomas Marieb, Paul McGregor, Shu Jin | 2005-12-20 | $37,307,000 |
| 6800554 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Thomas Marieb, Paul McGregor, Shu Jin | 2004-10-05 | $22,015,000 |
| 6794755 | Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement | Jose Maiz, Xiaorong Morrow, Thomas Marieb, Jihperng Leu, Paul McGregor +2 more | 2004-09-21 | $17,403,000 |