Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement

Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement

US Patent 6794755 · Granted Sep 21, 2004

Estimated economic value: $17,403,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for synchronization of independently encoded media streams2025
Systems and methods for delivery of content in association with notification mes2025
Subscription management and web-based activity tracking in a computing environme2025
Cladded metal interconnects2023
Subscription management and web-based activity tracking in a computing environme2023
Surgeon specific bone plates2022
Dialysis system and methods2022
Resistive memory cells and precursors thereof, methods of making the same, and d2021
Resistive memory cells and precursors thereof, methods of making the same, and d2019
Surgical retaining instruments for bone plates2019
Compact unit2019
Two-dimensional condensation for uniaxially strained semiconductor fins2019