Issued Patents All Time
Showing 25 most recent of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400913 | Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication | Elijah V. Karpov, Mohit K. HARAN, Reken Patel, Charles H. Wallace, Gurpreet Singh +5 more | 2025-08-26 |
| 12341092 | Planar slab vias for integrated circuit interconnects | Elijah V. Karpov, Nafees Kabir | 2025-06-24 |
| 12342551 | Capacitor architectures in semiconductor devices | Sudipto Naskar, Abhishek A. Sharma, Roman Caudillo, Scott B. Clendenning, Cheyun Lin | 2025-06-24 |
| 12293913 | Directed self-assembly enabled subtractive metal patterning | Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Nafees Kabir, Gauri Nabar +7 more | 2025-05-06 |
| 12266527 | Directed self-assembly enabled patterning over metal layers using assisting features | Gurpreet Singh, Nityan NAIR, Nafees Kabir, Eungnak Han, Xuanxuan Chen +6 more | 2025-04-01 |
| 12261114 | Metallization stacks with self-aligned staggered metal lines | Elijah V. Karpov, Christopher J. Jezewski, Nafees Kabir, Matthew V. Metz | 2025-03-25 |
| 12237223 | Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication | Paul A. Nyhus, Charles H. Wallace, Mohit K. HARAN, Gurpreet Singh, Eungnak Han +5 more | 2025-02-25 |
| 12230536 | Self-assembled guided hole and via patterning over grating | Florian Gstrein, Eungnak Han, Gurpreet Singh | 2025-02-18 |
| 12218052 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2025-02-04 |
| 12176214 | Selective metal removal for conductive interconnects in integrated circuitry | Kevin Lin, Rahim Kasim, Florian Gstrein | 2024-12-24 |
| 12131991 | Self aligned gratings for tight pitch interconnects and methods of fabrication | Leonard P. GULER, Paul A. Nyhus, Gobind Bisht, Jonathan Laib, David Shykind +5 more | 2024-10-29 |
| 12087836 | Contact over active gate structures with metal oxide-caped contacts to inhibit shorting | Rami Hourani, Richard Vreeland, Giselle Elbaz, Richard E. Schenker, Gurpreet Singh +4 more | 2024-09-10 |
| 12087594 | Colored gratings in microelectronic structures | Gurpreet Singh, Eungnak Han, Richard E. Schenker, Florian Gstrein, Paul A. Nyhus +1 more | 2024-09-10 |
| 12080639 | Contact over active gate structures with metal oxide layers to inhibit shorting | Rami Hourani, Richard E. Schenker, Florian Gstrein, Leonard P. GULER, Charles H. Wallace +4 more | 2024-09-03 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2024-07-02 |
| 11990403 | Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom | Kevin Lin, Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani | 2024-05-21 |
| 11901404 | Capacitor architectures in semiconductor devices | Sudipto Naskar, Abhishek A. Sharma, Roman Caudillo, Scott B. Clendenning, Cheyun Lin | 2024-02-13 |
| 11894270 | Grating replication using helmets and topographically-selective deposition | Kevin Lin, Sudipto Naskar, Miriam Reshotko, Rami Hourani | 2024-02-06 |
| 11887887 | Interconnect structures and methods of fabrication | Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more | 2024-01-30 |
| 11862463 | Metal oxide nanoparticles as fillable hardmask materials | Marie Krysak, Florian Gstrein | 2024-01-02 |
| 11854787 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2023-12-26 |
| 11837644 | Contact over active gate structures with metal oxide-caped contacts to inhibit shorting | Rami Hourani, Richard Vreeland, Giselle Elbaz, Richard E. Schenker, Gurpreet Singh +4 more | 2023-12-05 |
| 11837542 | Interconnects having a portion without a liner material and related structures, devices, and methods | Richard E. Schenker, Tristan A. Tronic | 2023-12-05 |
| 11791375 | Capacitor architectures in semiconductor devices | Sudipto Naskar, Abhishek A. Sharma, Roman Caudillo, Scott B. Clendenning, Cheyun Lin | 2023-10-17 |
| 11664305 | Staggered lines for interconnect performance improvement and processes for forming such | Kevin Lin, Miriam Reshotko, Christopher J. Jezewski, Eungnak Han, Gurpreet Singh +2 more | 2023-05-30 |