| 12506032 |
Self-assembled guided hole and via patterning over grating |
Florian Gstrein, Eungnak Han, Gurpreet Singh |
2025-12-23 |
|
| 12482744 |
Subtractively patterned interconnect structures for integrated circuits |
Keh-I Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2025-11-25 |
|
| 12400913 |
Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication |
Elijah V. Karpov, Mohit K. HARAN, Reken Patel, Charles H. Wallace, Gurpreet Singh +5 more |
2025-08-26 |
|
| 12341092 |
Planar slab vias for integrated circuit interconnects |
Elijah V. Karpov, Nafees Kabir |
2025-06-24 |
|
| 12342551 |
Capacitor architectures in semiconductor devices |
Sudipto Naskar, Abhishek A. Sharma, Roman Caudillo, Scott B. Clendenning, Cheyun Lin |
2025-06-24 |
|
| 12293913 |
Directed self-assembly enabled subtractive metal patterning |
Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Nafees Kabir, Gauri Nabar +7 more |
2025-05-06 |
|
| 12266527 |
Directed self-assembly enabled patterning over metal layers using assisting features |
Gurpreet Singh, Nityan NAIR, Nafees Kabir, Eungnak Han, Xuanxuan Chen +6 more |
2025-04-01 |
|
| 12261114 |
Metallization stacks with self-aligned staggered metal lines |
Elijah V. Karpov, Christopher J. Jezewski, Nafees Kabir, Matthew V. Metz |
2025-03-25 |
|
| 12237223 |
Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication |
Paul A. Nyhus, Charles H. Wallace, Mohit K. HARAN, Gurpreet Singh, Eungnak Han +5 more |
2025-02-25 |
|
| 12230536 |
Self-assembled guided hole and via patterning over grating |
Florian Gstrein, Eungnak Han, Gurpreet Singh |
2025-02-18 |
|
| 12218052 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
2025-02-04 |
|
| 12176214 |
Selective metal removal for conductive interconnects in integrated circuitry |
Kevin Lin, Rahim Kasim, Florian Gstrein |
2024-12-24 |
$17,261,000 |
| 12131991 |
Self aligned gratings for tight pitch interconnects and methods of fabrication |
Leonard P. GULER, Paul A. Nyhus, Gobind Bisht, Jonathan Laib, David Shykind +5 more |
2024-10-29 |
$18,861,000 |
| 12087836 |
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting |
Rami Hourani, Richard Vreeland, Giselle Elbaz, Richard E. Schenker, Gurpreet Singh +4 more |
2024-09-10 |
$16,964,000 |
| 12087594 |
Colored gratings in microelectronic structures |
Gurpreet Singh, Eungnak Han, Richard E. Schenker, Florian Gstrein, Paul A. Nyhus +1 more |
2024-09-10 |
$16,964,000 |
| 12080639 |
Contact over active gate structures with metal oxide layers to inhibit shorting |
Rami Hourani, Richard E. Schenker, Florian Gstrein, Leonard P. GULER, Charles H. Wallace +4 more |
2024-09-03 |
$14,017,000 |
| 12027458 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2024-07-02 |
$27,114,000 |
| 11990403 |
Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom |
Kevin Lin, Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani |
2024-05-21 |
$18,840,000 |
| 11901404 |
Capacitor architectures in semiconductor devices |
Sudipto Naskar, Abhishek A. Sharma, Roman Caudillo, Scott B. Clendenning, Cheyun Lin |
2024-02-13 |
$18,546,000 |
| 11894270 |
Grating replication using helmets and topographically-selective deposition |
Kevin Lin, Sudipto Naskar, Miriam Reshotko, Rami Hourani |
2024-02-06 |
$35,892,000 |
| 11887887 |
Interconnect structures and methods of fabrication |
Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more |
2024-01-30 |
$30,721,000 |
| 11862463 |
Metal oxide nanoparticles as fillable hardmask materials |
Marie Krysak, Florian Gstrein |
2024-01-02 |
$30,016,000 |
| 11854787 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
2023-12-26 |
$39,948,000 |
| 11837644 |
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting |
Rami Hourani, Richard Vreeland, Giselle Elbaz, Richard E. Schenker, Gurpreet Singh +4 more |
2023-12-05 |
$33,749,000 |
| 11837542 |
Interconnects having a portion without a liner material and related structures, devices, and methods |
Richard E. Schenker, Tristan A. Tronic |
2023-12-05 |
$33,749,000 |
