Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412838 | Integrated circuit structure with filled recesses | Kevin Lin, Nafees Kabir, Rami Hourani | 2025-09-09 |
| 12341061 | Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication | Florian Gstrein, Rami Hourani, Gopinath Bhimarasetti | 2025-06-24 |
| 12260296 | Diamondoid materials in quantum computing devices | David J. Michalak, John J. Plombon, James S. Clarke | 2025-03-25 |
| 12218052 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, Marie Krysak +6 more | 2025-02-04 |
| 12036578 | Interconnect structure surface modifications by passivating agents | Florian Gstrein, Eungnak Han, Rami Hourani, Tayseer Mahdi | 2024-07-16 |
| 12037434 | Chemical compositions and methods of patterning microelectronic device structures | Eungnak Han, Gurpreet Singh, Tayseer Mahdi, Florian Gstrein, Lauren Doyle +2 more | 2024-07-16 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2024-07-02 |
| 12012473 | Directed self-assembly structures and techniques | Robert L. Bristol, Xuanxuan Chen, Lauren Doyle, Florian Gstrein, Eungnak Han +6 more | 2024-06-18 |
| 11984317 | EUV patterning methods, structures, and materials | Marie Krysak, Lauren Doyle, Brian Zaccheo, Patrick Theofanis, Michael Robinson +1 more | 2024-05-14 |
| 11955377 | Differential hardmasks for modulation of electrobucket sensitivity | Kevin Lin, Robert L. Bristol, Rami Hourani, Marie Krysak | 2024-04-09 |
| 11955343 | Two-stage bake photoresist with releasable quencher | Robert L. Bristol, Marie Krysak, Florian Gstrein, Kent N. FRASURE | 2024-04-09 |
| 11953826 | Lined photobucket structure for back end of line (BEOL) interconnect formation | Robert L. Bristol, Marie Krysak, Florian Gstrein, Eungnak Han, Kevin Lin +2 more | 2024-04-09 |
| 11874600 | Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists | Marie Krysak, Robert L. Bristol, Florian Gstrein | 2024-01-16 |
| 11854787 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, Marie Krysak +6 more | 2023-12-26 |
| 11846883 | Chain scission photoresists and methods for forming chain scission photoresists | Robert L. Bristol, Marie Krysak, Lauren Doyle, Eungnak Han | 2023-12-19 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11406972 | Activation of protected cross-linking catalysts during formation of dielectric materials | David J. Michalak, Jessica M. Torres, Marie Krysak, Jeffery D. Bielefeld | 2022-08-09 |
| 11373950 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, Marie Krysak +6 more | 2022-06-28 |
| 11320734 | Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists | Marie Krysak, Robert L. Bristol, Florian Gstrein | 2022-05-03 |
| 11315798 | Two-stage bake photoresist with releasable quencher | Robert L. Bristol, Marie Krysak, Florian Gstrein, Kent N. FRASURE | 2022-04-26 |
| 11262654 | Chain scission resist compositions for EUV lithography applications | Lauren Doyle, Marie Krysak, Patrick Theofanis, Eungnak Han | 2022-03-01 |
| 11251072 | Differential hardmasks for modulation of electrobucket sensitivity | Kevin Lin, Robert L. Bristol, Rami Hourani, Marie Krysak | 2022-02-15 |
| 11232980 | Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication | Florian Gstrein, Rami Hourani, Gopinath Bhimarasetti | 2022-01-25 |
| 11217456 | Selective etching and controlled atomic layer etching of transition metal oxide films for device fabrication | Scott B. Clendenning, Cen Tan, Marie Krysak | 2022-01-04 |
| 11217455 | Carbon-based dielectric materials for semiconductor structure fabrication and the resulting structures | Tayseer Mahdi | 2022-01-04 |