| 12482744 |
Subtractively patterned interconnect structures for integrated circuits |
Keh-I Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2025-11-25 |
|
| 12412838 |
Integrated circuit structure with filled recesses |
Kevin Lin, Nafees Kabir, Rami Hourani |
2025-09-09 |
|
| 12341061 |
Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication |
Florian Gstrein, Rami Hourani, Gopinath Bhimarasetti |
2025-06-24 |
|
| 12260296 |
Diamondoid materials in quantum computing devices |
David J. Michalak, John J. Plombon, James S. Clarke |
2025-03-25 |
|
| 12218052 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, Marie Krysak +6 more |
2025-02-04 |
|
| 12037434 |
Chemical compositions and methods of patterning microelectronic device structures |
Eungnak Han, Gurpreet Singh, Tayseer Mahdi, Florian Gstrein, Lauren Doyle +2 more |
2024-07-16 |
$26,089,000 |
| 12036578 |
Interconnect structure surface modifications by passivating agents |
Florian Gstrein, Eungnak Han, Rami Hourani, Tayseer Mahdi |
2024-07-16 |
$26,089,000 |
| 12027458 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2024-07-02 |
$27,114,000 |
| 12012473 |
Directed self-assembly structures and techniques |
Robert L. Bristol, Xuanxuan Chen, Lauren Doyle, Florian Gstrein, Eungnak Han +6 more |
2024-06-18 |
$26,452,000 |
| 11984317 |
EUV patterning methods, structures, and materials |
Marie Krysak, Lauren Doyle, Brian Zaccheo, Patrick Theofanis, Michael Robinson +1 more |
2024-05-14 |
$33,809,000 |
| 11955343 |
Two-stage bake photoresist with releasable quencher |
Robert L. Bristol, Marie Krysak, Florian Gstrein, Kent N. FRASURE |
2024-04-09 |
$27,197,000 |
| 11953826 |
Lined photobucket structure for back end of line (BEOL) interconnect formation |
Robert L. Bristol, Marie Krysak, Florian Gstrein, Eungnak Han, Kevin Lin +2 more |
2024-04-09 |
$27,197,000 |
| 11955377 |
Differential hardmasks for modulation of electrobucket sensitivity |
Kevin Lin, Robert L. Bristol, Rami Hourani, Marie Krysak |
2024-04-09 |
$27,197,000 |
| 11874600 |
Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists |
Marie Krysak, Robert L. Bristol, Florian Gstrein |
2024-01-16 |
$42,805,000 |
| 11854787 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, Marie Krysak +6 more |
2023-12-26 |
$39,948,000 |
| 11846883 |
Chain scission photoresists and methods for forming chain scission photoresists |
Robert L. Bristol, Marie Krysak, Lauren Doyle, Eungnak Han |
2023-12-19 |
$50,836,000 |
| 11444024 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2022-09-13 |
$14,653,000 |
| 11406972 |
Activation of protected cross-linking catalysts during formation of dielectric materials |
David J. Michalak, Jessica M. Torres, Marie Krysak, Jeffery D. Bielefeld |
2022-08-09 |
$13,688,000 |
| 11373950 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, Marie Krysak +6 more |
2022-06-28 |
$15,065,000 |
| 11320734 |
Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists |
Marie Krysak, Robert L. Bristol, Florian Gstrein |
2022-05-03 |
$16,346,000 |
| 11315798 |
Two-stage bake photoresist with releasable quencher |
Robert L. Bristol, Marie Krysak, Florian Gstrein, Kent N. FRASURE |
2022-04-26 |
$25,630,000 |
| 11262654 |
Chain scission resist compositions for EUV lithography applications |
Lauren Doyle, Marie Krysak, Patrick Theofanis, Eungnak Han |
2022-03-01 |
$16,941,000 |
| 11251072 |
Differential hardmasks for modulation of electrobucket sensitivity |
Kevin Lin, Robert L. Bristol, Rami Hourani, Marie Krysak |
2022-02-15 |
$14,138,000 |
| 11232980 |
Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication |
Florian Gstrein, Rami Hourani, Gopinath Bhimarasetti |
2022-01-25 |
$21,146,000 |
| 11217456 |
Selective etching and controlled atomic layer etching of transition metal oxide films for device fabrication |
Scott B. Clendenning, Cen Tan, Marie Krysak |
2022-01-04 |
$22,100,000 |
