Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381161 | Backside wafer treatments to reduce distortions and overlay errors during wafer chucking | Grant Kloster, Florian Gstrein | 2025-08-05 |
| 12293913 | Directed self-assembly enabled subtractive metal patterning | Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Nafees Kabir, Gauri Nabar +7 more | 2025-05-06 |
| 12036578 | Interconnect structure surface modifications by passivating agents | Florian Gstrein, James M. Blackwell, Eungnak Han, Rami Hourani | 2024-07-16 |
| 12037434 | Chemical compositions and methods of patterning microelectronic device structures | Eungnak Han, Gurpreet Singh, Florian Gstrein, Lauren Doyle, Marie Krysak +2 more | 2024-07-16 |
| 12012473 | Directed self-assembly structures and techniques | James M. Blackwell, Robert L. Bristol, Xuanxuan Chen, Lauren Doyle, Florian Gstrein +6 more | 2024-06-18 |
| 11398428 | Multifunctional molecules for selective polymer formation on conductive surfaces and structures resulting therefrom | Eungnak Han, Rami Hourani, Gurpreet Singh, Florian Gstrein | 2022-07-26 |
| 11217455 | Carbon-based dielectric materials for semiconductor structure fabrication and the resulting structures | James M. Blackwell | 2022-01-04 |
| 11024538 | Hardened plug for improved shorting margin | Kevin Lin, Jessica M. Torres, Jeffery D. Bielefeld, Marie Krysak, James M. Blackwell | 2021-06-01 |