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Backside wafer treatments to reduce distortions and overlay errors during wafer chucking |
Grant Kloster, Florian Gstrein |
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| 12293913 |
Directed self-assembly enabled subtractive metal patterning |
Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Nafees Kabir, Gauri Nabar +7 more |
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| 12036578 |
Interconnect structure surface modifications by passivating agents |
Florian Gstrein, James M. Blackwell, Eungnak Han, Rami Hourani |
2024-07-16 |
| 12037434 |
Chemical compositions and methods of patterning microelectronic device structures |
Eungnak Han, Gurpreet Singh, Florian Gstrein, Lauren Doyle, Marie Krysak +2 more |
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| 12012473 |
Directed self-assembly structures and techniques |
James M. Blackwell, Robert L. Bristol, Xuanxuan Chen, Lauren Doyle, Florian Gstrein +6 more |
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| 11398428 |
Multifunctional molecules for selective polymer formation on conductive surfaces and structures resulting therefrom |
Eungnak Han, Rami Hourani, Gurpreet Singh, Florian Gstrein |
2022-07-26 |
| 11217455 |
Carbon-based dielectric materials for semiconductor structure fabrication and the resulting structures |
James M. Blackwell |
2022-01-04 |
| 11024538 |
Hardened plug for improved shorting margin |
Kevin Lin, Jessica M. Torres, Jeffery D. Bielefeld, Marie Krysak, James M. Blackwell |
2021-06-01 |