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Integrated circuit structure with filled recesses |
Kevin Lin, James M. Blackwell, Rami Hourani |
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Planar slab vias for integrated circuit interconnects |
Elijah V. Karpov, Manish Chandhok |
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Directed self-assembly enabled subtractive metal patterning |
Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Gauri Nabar, Eungnak Han +7 more |
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Angled etch to enable tin removal from selected sidewalls |
Shriram Shivaraman, Seung Hoon Sung, Uygar E. Avci |
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| 12266527 |
Directed self-assembly enabled patterning over metal layers using assisting features |
Gurpreet Singh, Nityan NAIR, Eungnak Han, Xuanxuan Chen, Brandon Holybee +6 more |
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Metallization stacks with self-aligned staggered metal lines |
Elijah V. Karpov, Christopher J. Jezewski, Manish Chandhok, Matthew V. Metz |
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| 12087836 |
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting |
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Subtractively patterned interconnect structures for integrated circuits |
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Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld +2 more |
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Contact over active gate structures with metal oxide-caped contacts to inhibit shorting |
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| 11784123 |
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Richard Vreeland, Colin T. Carver, William Brezinski, Michael Christenson |
2023-10-10 |
| 11646266 |
Helmet structures for semiconductor interconnects |
Kevin Lin, Miriam Reshotko |
2023-05-09 |
| 11610810 |
Maskless air gap enabled by a single damascene process |
Miriam Reshotko, Richard E. Schenker |
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| 11594673 |
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Noriyuki Sato, Angeline Smith, Tanay Gosavi, Sasikanth Manipatruni, Kaan Oguz +8 more |
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Single mask lithography line end enhancement |
Kevin Lin, Richard E. Schenker |
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Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
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Self-aligned local interconnects |
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| 11404482 |
Self-aligned repeatedly stackable 3D vertical RRAM |
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Stacked transistor structures with asymmetrical terminal interconnects |
Aaron D. Lilak, Ehren Mannebach, Patrick Morrow, Gilbert Dewey, Willy Rachmady +1 more |
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| 11289421 |
Methods and structures for improved electrical contact between bonded integrated circuit interfaces |
Richard Vreeland, Colin T. Carver, William Brezinski, Michael Christenson |
2022-03-29 |
| 11239156 |
Planar slab vias for integrated circuit interconnects |
Elijah V. Karpov, Manish Chandhok |
2022-02-01 |
| 10665499 |
Integrated circuit with airgaps to control capacitance |
Miriam Reshotko, Manish Chandhok |
2020-05-26 |