Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412838 | Integrated circuit structure with filled recesses | Kevin Lin, James M. Blackwell, Rami Hourani | 2025-09-09 |
| 12341092 | Planar slab vias for integrated circuit interconnects | Elijah V. Karpov, Manish Chandhok | 2025-06-24 |
| 12293913 | Directed self-assembly enabled subtractive metal patterning | Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Gauri Nabar, Eungnak Han +7 more | 2025-05-06 |
| 12266729 | Angled etch to enable tin removal from selected sidewalls | Shriram Shivaraman, Seung Hoon Sung, Uygar E. Avci | 2025-04-01 |
| 12266527 | Directed self-assembly enabled patterning over metal layers using assisting features | Gurpreet Singh, Nityan NAIR, Eungnak Han, Xuanxuan Chen, Brandon Holybee +6 more | 2025-04-01 |
| 12261114 | Metallization stacks with self-aligned staggered metal lines | Elijah V. Karpov, Christopher J. Jezewski, Manish Chandhok, Matthew V. Metz | 2025-03-25 |
| 12087836 | Contact over active gate structures with metal oxide-caped contacts to inhibit shorting | Rami Hourani, Richard Vreeland, Giselle Elbaz, Manish Chandhok, Richard E. Schenker +4 more | 2024-09-10 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2024-07-02 |
| 11887887 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld +2 more | 2024-01-30 |
| 11837644 | Contact over active gate structures with metal oxide-caped contacts to inhibit shorting | Rami Hourani, Richard Vreeland, Giselle Elbaz, Manish Chandhok, Richard E. Schenker +4 more | 2023-12-05 |
| 11784123 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Richard Vreeland, Colin T. Carver, William Brezinski, Michael Christenson | 2023-10-10 |
| 11646266 | Helmet structures for semiconductor interconnects | Kevin Lin, Miriam Reshotko | 2023-05-09 |
| 11610810 | Maskless air gap enabled by a single damascene process | Miriam Reshotko, Richard E. Schenker | 2023-03-21 |
| 11594673 | Two terminal spin orbit memory devices and methods of fabrication | Noriyuki Sato, Angeline Smith, Tanay Gosavi, Sasikanth Manipatruni, Kaan Oguz +8 more | 2023-02-28 |
| 11462469 | Single mask lithography line end enhancement | Kevin Lin, Richard E. Schenker | 2022-10-04 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11424160 | Self-aligned local interconnects | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +5 more | 2022-08-23 |
| 11404482 | Self-aligned repeatedly stackable 3D vertical RRAM | Noriyuki Sato, Kevin P. O'Brien, Eungnak Han, Manish Chandhok, Gurpreet Singh +4 more | 2022-08-02 |
| 11404307 | Interconnect structures and methods of fabrication | Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld +2 more | 2022-08-02 |
| 11342227 | Stacked transistor structures with asymmetrical terminal interconnects | Aaron D. Lilak, Ehren Mannebach, Patrick Morrow, Gilbert Dewey, Willy Rachmady +1 more | 2022-05-24 |
| 11289421 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Richard Vreeland, Colin T. Carver, William Brezinski, Michael Christenson | 2022-03-29 |
| 11239156 | Planar slab vias for integrated circuit interconnects | Elijah V. Karpov, Manish Chandhok | 2022-02-01 |
| 10665499 | Integrated circuit with airgaps to control capacitance | Miriam Reshotko, Manish Chandhok | 2020-05-26 |