| 12484247 |
Gate-all-around integrated circuit structures having backside contact with enhanced area relative to epitaxial source |
Joseph D'SILVA, Mauro J. Kobrinsky, Shaun MILLS, Makram ABD EL QADER, Leonard P. GULER |
2025-11-25 |
|
| 12482744 |
Subtractively patterned interconnect structures for integrated circuits |
Keh-I Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2025-11-25 |
|
| 12412838 |
Integrated circuit structure with filled recesses |
Kevin Lin, James M. Blackwell, Rami Hourani |
2025-09-09 |
|
| 12341092 |
Planar slab vias for integrated circuit interconnects |
Elijah V. Karpov, Manish Chandhok |
2025-06-24 |
|
| 12293913 |
Directed self-assembly enabled subtractive metal patterning |
Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Gauri Nabar, Eungnak Han +7 more |
2025-05-06 |
|
| 12266729 |
Angled etch to enable tin removal from selected sidewalls |
Shriram Shivaraman, Seung Hoon Sung, Uygar E. Avci |
2025-04-01 |
|
| 12266527 |
Directed self-assembly enabled patterning over metal layers using assisting features |
Gurpreet Singh, Nityan NAIR, Eungnak Han, Xuanxuan Chen, Brandon Holybee +6 more |
2025-04-01 |
|
| 12261114 |
Metallization stacks with self-aligned staggered metal lines |
Elijah V. Karpov, Christopher J. Jezewski, Manish Chandhok, Matthew V. Metz |
2025-03-25 |
|
| 12087836 |
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting |
Rami Hourani, Richard Vreeland, Giselle Elbaz, Manish Chandhok, Richard E. Schenker +4 more |
2024-09-10 |
$16,964,000 |
| 12027458 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2024-07-02 |
$27,114,000 |
| 11887887 |
Interconnect structures and methods of fabrication |
Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld +2 more |
2024-01-30 |
$30,721,000 |
| 11837644 |
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting |
Rami Hourani, Richard Vreeland, Giselle Elbaz, Manish Chandhok, Richard E. Schenker +4 more |
2023-12-05 |
$33,749,000 |
| 11784123 |
Methods and structures for improved electrical contact between bonded integrated circuit interfaces |
Richard Vreeland, Colin T. Carver, William Brezinski, Michael Christenson |
2023-10-10 |
$20,947,000 |
| 11646266 |
Helmet structures for semiconductor interconnects |
Kevin Lin, Miriam Reshotko |
2023-05-09 |
$19,706,000 |
| 11610810 |
Maskless air gap enabled by a single damascene process |
Miriam Reshotko, Richard E. Schenker |
2023-03-21 |
$20,076,000 |
| 11594673 |
Two terminal spin orbit memory devices and methods of fabrication |
Noriyuki Sato, Angeline Smith, Tanay Gosavi, Sasikanth Manipatruni, Kaan Oguz +8 more |
2023-02-28 |
$10,430,000 |
| 11462469 |
Single mask lithography line end enhancement |
Kevin Lin, Richard E. Schenker |
2022-10-04 |
$13,460,000 |
| 11444024 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more |
2022-09-13 |
$14,653,000 |
| 11424160 |
Self-aligned local interconnects |
Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +5 more |
2022-08-23 |
$15,804,000 |
| 11404307 |
Interconnect structures and methods of fabrication |
Manish Chandhok, Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld +2 more |
2022-08-02 |
$13,520,000 |
| 11404482 |
Self-aligned repeatedly stackable 3D vertical RRAM |
Noriyuki Sato, Kevin P. O'Brien, Eungnak Han, Manish Chandhok, Gurpreet Singh +4 more |
2022-08-02 |
$13,520,000 |
| 11342227 |
Stacked transistor structures with asymmetrical terminal interconnects |
Aaron D. Lilak, Ehren Mannebach, Patrick Morrow, Gilbert Dewey, Willy Rachmady +1 more |
2022-05-24 |
$18,289,000 |
| 11289421 |
Methods and structures for improved electrical contact between bonded integrated circuit interfaces |
Richard Vreeland, Colin T. Carver, William Brezinski, Michael Christenson |
2022-03-29 |
$28,068,000 |
| 11239156 |
Planar slab vias for integrated circuit interconnects |
Elijah V. Karpov, Manish Chandhok |
2022-02-01 |
$16,992,000 |
| 10665499 |
Integrated circuit with airgaps to control capacitance |
Miriam Reshotko, Manish Chandhok |
2020-05-26 |
$31,191,000 |
