Issued Patents All Time
Showing 26–50 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557536 | Integrated circuits (IC's) with electro-migration (EM)—resistant segments in an interconnect level | Kevin Lin, Christopher J. Jezewski | 2023-01-17 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Christopher J. Jezewski +10 more | 2022-09-13 |
| 11417567 | Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom | Florian Gstrein, Eungnak Han, Rami Hourani, Ruth A. Brain, Paul A. Nyhus +2 more | 2022-08-16 |
| 11404307 | Interconnect structures and methods of fabrication | Ramanan V. Chebiam, Brennen Mueller, Colin T. Carver, Jeffery D. Bielefeld, Nafees Kabir +2 more | 2022-08-02 |
| 11404482 | Self-aligned repeatedly stackable 3D vertical RRAM | Noriyuki Sato, Kevin P. O'Brien, Eungnak Han, Gurpreet Singh, Nafees Kabir +4 more | 2022-08-02 |
| 11373950 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2022-06-28 |
| 11335598 | Grating replication using helmets and topographically-selective deposition | Kevin Lin, Sudipto Naskar, Miriam Reshotko, Rami Hourani | 2022-05-17 |
| 11264325 | Interconnects having a portion without a liner material and related structures, devices, and methods | Richard E. Schenker, Tristan A. Tronic | 2022-03-01 |
| 11264449 | Capacitor architectures in semiconductor devices | Sudipto Naskar, Abhishek A. Sharma, Roman Caudillo, Scott B. Clendenning, Cheyun Lin | 2022-03-01 |
| 11251117 | Self aligned gratings for tight pitch interconnects and methods of fabrication | Leonard P. GULER, Paul A. Nyhus, Gobind Bisht, Jonathan Laib, David Shykind +5 more | 2022-02-15 |
| 11239156 | Planar slab vias for integrated circuit interconnects | Elijah V. Karpov, Nafees Kabir | 2022-02-01 |
| 11239112 | Passivating silicide-based approaches for conductive via fabrication and structures resulting therefrom | Sudipto Naskar, Richard E. Schenker | 2022-02-01 |
| 11227766 | Metal oxide nanoparticles as fillable hardmask materials | Marie Krysak, Florian Gstrein | 2022-01-18 |
| 11158515 | Selective metal removal for conductive interconnects in integrated circuitry | Kevin Lin, Rahim Kasim, Florian Gstrein | 2021-10-26 |
| 11152254 | Pitch quartered three-dimensional air gaps | Sudipto Naskar, Stephanie A. Bojarski, Kevin Lin, Marie Krysak, Tristan A. Tronic +3 more | 2021-10-19 |
| 11011463 | Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom | Kevin Lin, Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani | 2021-05-18 |
| 10971394 | Maskless air gap to prevent via punch through | Todd R. Younkin, Eungnak Han, Jasmeet S. Chawla, Marie Krysak, Hui Jae Yoo +1 more | 2021-04-06 |
| 10937689 | Self-aligned hard masks with converted liners | Satyarth Suri, Tristan A. Tronic, Christopher J. Jezewski, Richard E. Schenker | 2021-03-02 |
| 10916499 | Vias and gaps in semiconductor interconnects | Kevin Lin | 2021-02-09 |
| 10892223 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2021-01-12 |
| 10886175 | Differentiated molecular domains for selective hardmask fabrication and structures resulting therefrom | Eungnak Han, Rami Hourani, Florian Gstrein, Gurpreet Singh, Scott B. Clendenning +1 more | 2021-01-05 |
| 10678137 | Multi-pass patterning using nonreflecting radiation lithography on an underlying grating | Todd R. Younkin, Sang Hun Lee, Charles H. Wallace | 2020-06-09 |
| 10665499 | Integrated circuit with airgaps to control capacitance | Miriam Reshotko, Nafees Kabir | 2020-05-26 |
| 10643946 | Nitrogen assisted oxide gapfill | Sudipto Naskar, Kevin Lin, Ryan Pearce | 2020-05-05 |
| 10559529 | Pitch division patterning approaches with increased overlay margin for back end of line (BEOL) interconnect fabrication and structures resulting therefrom | Charles H. Wallace, Leonard P. GULER, Paul A. Nyhus | 2020-02-11 |