| 12419085 |
Integrated circuit structures having backside gate tie-down |
Leonard P. GULER, Mauro J. Kobrinsky, Marni Nabors, Tahir Ghani, Charles H. Wallace +2 more |
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| 12406931 |
Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication |
Atul MADHAVAN, Nicholas J. Kybert, Hiten Kothari |
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| 12400913 |
Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication |
Manish Chandhok, Elijah V. Karpov, Reken Patel, Charles H. Wallace, Gurpreet Singh +5 more |
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| 12382721 |
Integrated circuit structures having cut metal gates with dielectric spacer fill |
Leonard P. GULER, Chanaka D. Munasinghe, Makram ABD EL QADER, Marie T. Conte, Saurabh Morarka +5 more |
2025-08-05 |
| 12369392 |
Fabrication of gate-all-around integrated circuit structures having pre-spacer deposition cut gates |
Leonard P. GULER, Michael K. Harper, William Hsu, Biswajeet Guha, Tahir Ghani +6 more |
2025-07-22 |
| 12308284 |
Plug and trench architectures for integrated circuits and methods of manufacture |
Charles H. Wallace, Marvin Young Paik, Hyunsoo Park, Alexander F. Kaplan, Ruth A. Brain |
2025-05-20 |
| 12310060 |
Gate-all-around integrated circuit structures having uniform threshold voltages and tight gate endcap tolerances |
Dan S. LAVRIC, Dax M. Crum, David J. TOWNER, Orb Acton, Jitendra Kumar Jha +3 more |
2025-05-20 |
| 12261122 |
Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication |
Atul MADHAVAN, Nicholas J. Kybert, Hiten Kothari |
2025-03-25 |
| 12237223 |
Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication |
Paul A. Nyhus, Charles H. Wallace, Manish Chandhok, Gurpreet Singh, Eungnak Han +5 more |
2025-02-25 |
| 12237388 |
Transistor arrangements with stacked trench contacts and gate straps |
Andy Wei, Changyok Park, Guillaume Bouche, Hyuk-Ju Ryu, Charles H. Wallace |
2025-02-25 |
| 12199161 |
Contact over active gate structures with tapered gate or trench contact for advanced integrated circuit structure fabrication |
Charles H. Wallace, Andy Wei |
2025-01-14 |
| 12154855 |
Self-aligned patterning with colored blocking and structures resulting therefrom |
Reken Patel, Richard E. Schenker, Charles H. Wallace |
2024-11-26 |
| 12080639 |
Contact over active gate structures with metal oxide layers to inhibit shorting |
Rami Hourani, Manish Chandhok, Richard E. Schenker, Florian Gstrein, Leonard P. GULER +4 more |
2024-09-03 |
| 12002678 |
Gate spacing in integrated circuit structures |
Charles H. Wallace, Paul A. Nyhus, Gurpreet Singh, Eungnak Han, David Shykind +1 more |
2024-06-04 |
| 11990472 |
Fabrication of gate-all-around integrated circuit structures having pre-spacer deposition cut gates |
Leonard P. GULER, Michael K. Harper, William Hsu, Biswajeet Guha, Tahir Ghani +6 more |
2024-05-21 |
| 11972979 |
1D vertical edge blocking (VEB) via and plug |
Leonard P. GULER, Michael K. Harper, Suzanne S. Rich, Charles H. Wallace, Curtis W. Ward +4 more |
2024-04-30 |
| 11721580 |
1D vertical edge blocking (VEB) via and plug |
Leonard P. GULER, Michael K. Harper, Suzanne S. Rich, Charles H. Wallace, Curtis W. Ward +4 more |
2023-08-08 |
| 11664274 |
Method to repair edge placement errors in a semiconductor device |
Charles H. Wallace, Gopinath Bhimarasetti |
2023-05-30 |
| 11652045 |
Via contact patterning method to increase edge placement error margin |
Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An, Debashish Basu +6 more |
2023-05-16 |
| 11393754 |
Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication |
Atul MADHAVAN, Nicholas J. Kybert, Hiten Kothari |
2022-07-19 |
| 11211324 |
Via contact patterning method to increase edge placement error margin |
Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An, Debashish Basu +6 more |
2021-12-28 |
| 11171043 |
Plug and trench architectures for integrated circuits and methods of manufacture |
Charles H. Wallace, Marvin Young Paik, Hyunsoo Park, Alexander F. Kaplan, Ruth A. Brain |
2021-11-09 |
| 11145541 |
Conductive via and metal line end fabrication and structures resulting therefrom |
Charles H. Wallace, Reken Patel, Hyunsoo Park, Debashish Basu, Curtis W. Ward +1 more |
2021-10-12 |
| 10636700 |
Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structures |
Paul A. Nyhus, Charles H. Wallace, Robert M. Bigwood, Deepak S. Rao, Alexander F. Kaplan |
2020-04-28 |
| 10319625 |
Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structures |
Paul A. Nyhus, Charles H. Wallace, Robert M. Bigwood, Deepak S. Rao, Alexander F. Kaplan |
2019-06-11 |