Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426230 | Fin cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth | 2025-09-23 |
| 12218052 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2025-02-04 |
| 12080639 | Contact over active gate structures with metal oxide layers to inhibit shorting | Rami Hourani, Manish Chandhok, Richard E. Schenker, Florian Gstrein, Leonard P. GULER +4 more | 2024-09-03 |
| 12016170 | Fin cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth | 2024-06-18 |
| 11972979 | 1D vertical edge blocking (VEB) via and plug | Leonard P. GULER, Michael K. Harper, Suzanne S. Rich, Charles H. Wallace, Richard E. Schenker +4 more | 2024-04-30 |
| 11881520 | Fin patterning for advanced integrated circuit structure fabrication | Heidi M. Meyer, Michael L. Hattendorf, Christopher P. Auth | 2024-01-23 |
| 11854787 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2023-12-26 |
| 11721580 | 1D vertical edge blocking (VEB) via and plug | Leonard P. GULER, Michael K. Harper, Suzanne S. Rich, Charles H. Wallace, Richard E. Schenker +4 more | 2023-08-08 |
| 11646359 | Fin cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth | 2023-05-09 |
| 11640985 | Trench isolation for advanced integrated circuit structure fabrication | Michael L. Hattendorf, Heidi M. Meyer, Tahir Ghani, Christopher P. Auth | 2023-05-02 |
| 11373950 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2022-06-28 |
| 11145541 | Conductive via and metal line end fabrication and structures resulting therefrom | Charles H. Wallace, Reken Patel, Hyunsoo Park, Mohit K. HARAN, Debashish Basu +1 more | 2021-10-12 |
| 11063133 | Fin cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth | 2021-07-13 |
| 10930753 | Trench isolation for advanced integrated circuit structure fabrication | Michael L. Hattendorf, Heidi M. Meyer, Tahir Ghani, Christopher P. Auth | 2021-02-23 |
| 10892223 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2021-01-12 |
| 10777656 | Fin cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth | 2020-09-15 |
| 10460993 | Fin cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth | 2019-10-29 |
| 9893167 | Integration methods to fabricate internal spacers for nanowire devices | Seiyon Kim, Daniel A. Simon, Kelin J. Kuhn | 2018-02-13 |