| 12426230 |
Fin cut and fin trim isolation for advanced integrated circuit structure fabrication |
Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth |
2025-09-23 |
|
| 12218052 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
2025-02-04 |
|
| 12080639 |
Contact over active gate structures with metal oxide layers to inhibit shorting |
Rami Hourani, Manish Chandhok, Richard E. Schenker, Florian Gstrein, Leonard P. GULER +4 more |
2024-09-03 |
$14,017,000 |
| 12016170 |
Fin cut and fin trim isolation for advanced integrated circuit structure fabrication |
Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth |
2024-06-18 |
$26,452,000 |
| 11972979 |
1D vertical edge blocking (VEB) via and plug |
Leonard P. GULER, Michael K. Harper, Suzanne S. Rich, Charles H. Wallace, Richard E. Schenker +4 more |
2024-04-30 |
$26,151,000 |
| 11881520 |
Fin patterning for advanced integrated circuit structure fabrication |
Heidi M. Meyer, Michael L. Hattendorf, Christopher P. Auth |
2024-01-23 |
$52,361,000 |
| 11854787 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
2023-12-26 |
$39,948,000 |
| 11721580 |
1D vertical edge blocking (VEB) via and plug |
Leonard P. GULER, Michael K. Harper, Suzanne S. Rich, Charles H. Wallace, Richard E. Schenker +4 more |
2023-08-08 |
$22,376,000 |
| 11646359 |
Fin cut and fin trim isolation for advanced integrated circuit structure fabrication |
Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth |
2023-05-09 |
$19,706,000 |
| 11640985 |
Trench isolation for advanced integrated circuit structure fabrication |
Michael L. Hattendorf, Heidi M. Meyer, Tahir Ghani, Christopher P. Auth |
2023-05-02 |
$21,235,000 |
| 11373950 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
2022-06-28 |
$15,065,000 |
| 11145541 |
Conductive via and metal line end fabrication and structures resulting therefrom |
Charles H. Wallace, Reken Patel, Hyunsoo Park, Mohit K. HARAN, Debashish Basu +1 more |
2021-10-12 |
$32,982,000 |
| 11063133 |
Fin cut and fin trim isolation for advanced integrated circuit structure fabrication |
Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth |
2021-07-13 |
$34,958,000 |
| 10930753 |
Trench isolation for advanced integrated circuit structure fabrication |
Michael L. Hattendorf, Heidi M. Meyer, Tahir Ghani, Christopher P. Auth |
2021-02-23 |
$31,062,000 |
| 10892223 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
2021-01-12 |
$55,416,000 |
| 10777656 |
Fin cut and fin trim isolation for advanced integrated circuit structure fabrication |
Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth |
2020-09-15 |
$34,212,000 |
| 10460993 |
Fin cut and fin trim isolation for advanced integrated circuit structure fabrication |
Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth |
2019-10-29 |
$25,165,000 |
| 9893167 |
Integration methods to fabricate internal spacers for nanowire devices |
Seiyon Kim, Daniel A. Simon, Kelin J. Kuhn |
2018-02-13 |
$15,494,000 |
