Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12368095 | Simultaneous filling of variable aspect ratio single damascene contact to gate and trench vias with low resistance barrierless selective metallization | Akm Shaestagir Chowdhury, Githin F. Alapatt, Justin Mueller, James Jeong | 2025-07-22 | |
| 11652045 | Via contact patterning method to increase edge placement error margin | Mohit K. HARAN, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An +6 more | 2023-05-16 | $11,130,000 |
| 11211324 | Via contact patterning method to increase edge placement error margin | Mohit K. HARAN, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An +6 more | 2021-12-28 | $27,770,000 |
| 11145541 | Conductive via and metal line end fabrication and structures resulting therefrom | Charles H. Wallace, Reken Patel, Hyunsoo Park, Mohit K. HARAN, Curtis W. Ward +1 more | 2021-10-12 | $32,982,000 |