| 12368095 |
Simultaneous filling of variable aspect ratio single damascene contact to gate and trench vias with low resistance barrierless selective metallization |
Akm Shaestagir Chowdhury, Debashish Basu, Githin F. Alapatt, Justin Mueller |
2025-07-22 |
| 12051623 |
Enhanced grating aligned patterning for EUV direct print processes |
Seyedhamed M Barghi, Shyam Benegal KADALI, Marvin Young Paik, Sheng-Po Fang, Leonard P. GULER +1 more |
2024-07-30 |
| 11652045 |
Via contact patterning method to increase edge placement error margin |
Mohit K. HARAN, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An +6 more |
2023-05-16 |
| 11211324 |
Via contact patterning method to increase edge placement error margin |
Mohit K. HARAN, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An +6 more |
2021-12-28 |
| 9748180 |
Through-body via liner deposition |
Puneesh Puri, Jiho Kang |
2017-08-29 |
| 9716066 |
Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias |
Kevin J. Lee, Hsiao-Kang Chang, John Muirhead, Adwait Telang, Puneesh Puri +2 more |
2017-07-25 |
| 7977248 |
Double patterning with single hard mask |
Elliot N. Tan, Michael K. Harper |
2011-07-12 |
| 7112534 |
Process for low k dielectric plasma etching with high selectivity to deep uv photoresist |
Qiang Fu |
2006-09-26 |