Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716066 | Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias | Kevin J. Lee, James Jeong, Hsiao-Kang Chang, Adwait Telang, Puneesh Puri +2 more | 2017-07-25 |