Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431386 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +4 more | 2025-09-30 |
| 12431426 | Semiconductor interconnection structures comprising a resistor device and methods of forming the same | Kai-Fang Cheng, Cherng-Shiaw Tsai, Cheng-Chin Lee, Ming-Hsien Lin | 2025-09-30 |
| 12424485 | Semiconductor structure with air gap and method for manufacturing the same | Kai-Fang Cheng | 2025-09-23 |
| 12412804 | Semiconductor structure with improved heat dissipation | Cheng-Chin Lee, Shau-Lin Shue, Shao-Kuan Lee, Cherng-Shiaw Tsai, Kai-Fang Cheng +6 more | 2025-09-09 |
| 12387928 | Method for manufacturing semiconductor structure with material in monocrystalline phase | Kai-Fang Cheng | 2025-08-12 |
| 12334431 | Semiconductor interconnection structures and methods of forming the same | Kai-Fang Cheng | 2025-06-17 |
| 12272597 | Semiconductor interconnection structures and methods of forming the same | Cheng-Chin Lee, Hsin-Yen Huang, Cherng-Shiaw Tsai, Shao-Kuan Lee, Shau-Lin Shue | 2025-04-08 |
| 12249555 | Semiconductor device package including a thermal conductive layer and methods of forming the same | Cheng-Chin Lee, Cherng-Shiaw Tsai, Shao-Kuan Lee, Hsin-Yen Huang, Shau-Lin Shue | 2025-03-11 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2024-12-10 |
| 12154850 | Semiconductor interconnection structures and methods of forming the same | Kai-Fang Cheng | 2024-11-26 |
| 12094764 | Interconnect structure and methods of forming the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +3 more | 2024-09-17 |
| 12094815 | Semiconductor structure having dielectric-on-dielectric structure and method for forming the semiconductor structure | Cheng-Chin Lee, Shao-Kuan Lee, Hsin-Yen Huang, Shau-Lin Shue | 2024-09-17 |
| 12080650 | Interconnect structure with low capacitance and high thermal conductivity | Kai-Fang Cheng, Ming-Han Lee | 2024-09-03 |
| 12074084 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue, Cherng-Shiaw Tsai | 2024-08-27 |
| 12068193 | Semiconductor device structure with interconnect structure having air gap | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Shau-Lin Shue | 2024-08-20 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +4 more | 2024-08-13 |
| 12002749 | Barrier and air-gap scheme for high performance interconnects | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee +1 more | 2024-06-04 |
| 11923243 | Semiconductor structure having air gaps and method for manufacturing the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee +1 more | 2024-03-05 |
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Cheng-Chin Lee, Ting-Ya Lo +3 more | 2023-12-26 |
| 11848198 | Method for manufacturing semiconductor device having low-k carbon-containing dielectric layer | Kai-Fang Cheng, Ting-Ya Lo | 2023-12-19 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2023-05-23 |
| 11640928 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue, Cherng-Shiaw Tsai | 2023-05-02 |
| 11538749 | Interconnect structure | Shao-Kuan Lee, Hsin-Yen Huang, Cheng-Chin Lee, Kuang-Wei YANG, Ting-Ya Lo +2 more | 2022-12-27 |
| 9716066 | Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias | Kevin J. Lee, James Jeong, John Muirhead, Adwait Telang, Puneesh Puri +2 more | 2017-07-25 |
| 8847313 | Transparent electronics based on transfer printed carbon nanotubes on rigid and flexible substrates | Chongwu Zhou, Fumiaki Ishikawa, Koungmin Ryu | 2014-09-30 |