Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431386 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2025-09-30 |
| 12431426 | Semiconductor interconnection structures comprising a resistor device and methods of forming the same | Kai-Fang Cheng, Cheng-Chin Lee, Ming-Hsien Lin, Hsiao-Kang Chang | 2025-09-30 |
| 12412804 | Semiconductor structure with improved heat dissipation | Cheng-Chin Lee, Shau-Lin Shue, Shao-Kuan Lee, Hsiao-Kang Chang, Kai-Fang Cheng +6 more | 2025-09-09 |
| 12412831 | Semiconductor device structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Yung-Hsu Wu, Chia-Wei Su | 2025-09-09 |
| 12272597 | Semiconductor interconnection structures and methods of forming the same | Cheng-Chin Lee, Hsiao-Kang Chang, Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue | 2025-04-08 |
| 12249555 | Semiconductor device package including a thermal conductive layer and methods of forming the same | Cheng-Chin Lee, Shao-Kuan Lee, Hsiao-Kang Chang, Hsin-Yen Huang, Shau-Lin Shue | 2025-03-11 |
| 12211700 | Selective removal of an etching stop layer for improving overlay shift tolerance | Chien-Hua Huang, Tzu-Hui Wei | 2025-01-28 |
| 12205946 | Semiconductor device structure and methods of forming the same | Kai-Fang Cheng, Kuang-Wei YANG, Hsiaokang CHANG | 2025-01-21 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2024-12-10 |
| 12132000 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Cheng-Chin Lee, Kuang-Wei YANG, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2024-10-29 |
| 12094764 | Interconnect structure and methods of forming the same | Cheng-Chin Lee, Hsiao-Kang Chang, Ting-Ya Lo, Chi-Lin Teng, Shao-Kuan Lee +3 more | 2024-09-17 |
| 12074084 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue, Hsiao-Kang Chang | 2024-08-27 |
| 12074060 | Semiconductor device structure and methods of forming the same | Cheng-Chin Lee, Shao-Kuan Lee, Kuang-Wei YANG, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2024-08-27 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2024-08-13 |
| 11923357 | Semiconductor device structure and methods of forming the same | Kai-Fang Cheng, Kuang-Wei YANG, Hsiaokang CHANG | 2024-03-05 |
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng +3 more | 2023-12-26 |
| 11664237 | Semiconductor device having improved overlay shift tolerance | Chien-Hua Huang, Tzu-Hui Wei | 2023-05-30 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2023-05-23 |
| 11640928 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue, Hsiao-Kang Chang | 2023-05-02 |
| 10998225 | Semiconductor device and method of forming the same | Tzu-Hui Wei, Chien-Hua Huang, Chung-Ju Lee | 2021-05-04 |
| 10867805 | Selective removal of an etching stop layer for improving overlay shift tolerance | Chien-Hua Huang, Tzu-Hui Wei | 2020-12-15 |
| 9627215 | Structure and method for interconnection | Chien-Hua Huang, Cheng-Hsiung Tsai, Chung-Ju Lee | 2017-04-18 |