Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431426 | Semiconductor interconnection structures comprising a resistor device and methods of forming the same | Cherng-Shiaw Tsai, Cheng-Chin Lee, Ming-Hsien Lin, Hsiao-Kang Chang | 2025-09-30 |
| 12424485 | Semiconductor structure with air gap and method for manufacturing the same | Hsiao-Kang Chang | 2025-09-23 |
| 12412804 | Semiconductor structure with improved heat dissipation | Cheng-Chin Lee, Shau-Lin Shue, Shao-Kuan Lee, Hsiao-Kang Chang, Cherng-Shiaw Tsai +6 more | 2025-09-09 |
| 12387928 | Method for manufacturing semiconductor structure with material in monocrystalline phase | Hsiao-Kang Chang | 2025-08-12 |
| 12334431 | Semiconductor interconnection structures and methods of forming the same | Hsiao-Kang Chang | 2025-06-17 |
| 12205946 | Semiconductor device structure and methods of forming the same | Kuang-Wei YANG, Cherng-Shiaw Tsai, Hsiaokang CHANG | 2025-01-21 |
| 12176247 | Metal oxide composite as etch stop layer | Chi-Lin Teng, Hsin-Yen Huang, Hai-Ching Chen | 2024-12-24 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2024-12-10 |
| 12154850 | Semiconductor interconnection structures and methods of forming the same | Hsiao-Kang Chang | 2024-11-26 |
| 12080650 | Interconnect structure with low capacitance and high thermal conductivity | Hsiao-Kang Chang, Ming-Han Lee | 2024-09-03 |
| 11923357 | Semiconductor device structure and methods of forming the same | Kuang-Wei YANG, Cherng-Shiaw Tsai, Hsiaokang CHANG | 2024-03-05 |
| 11848198 | Method for manufacturing semiconductor device having low-k carbon-containing dielectric layer | Ting-Ya Lo, Hsiao-Kang Chang | 2023-12-19 |
| 11830808 | Semiconductor structure and method making the same | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Tien-I Bao | 2023-11-28 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2023-05-23 |
| 11450566 | Semiconductor device and manufacturing method thereof | Hsin-Yen Huang, Chi-Lin Teng, Shao-Kuan Lee, Hai-Ching Chen | 2022-09-20 |
| 11328991 | Semiconductor structure and method making the same | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Tien-I Bao | 2022-05-10 |
| 11315828 | Metal oxide composite as etch stop layer | Chi-Lin Teng, Hsin-Yen Huang, Hai-Ching Chen | 2022-04-26 |
| 11049811 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Jung-Hsun Tsai, Hsin-Yen Huang, Hai-Ching Chen, Tien-I Bao | 2021-06-29 |
| 10983278 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2021-04-20 |
| 10867847 | Semiconductor device and manufacturing method thereof | Hsin-Yen Huang, Chi-Lin Teng, Shao-Kuan Lee, Hai-Ching Chen | 2020-12-15 |
| 10700000 | Semiconductor structure and method making the same | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Tien-I Bao | 2020-06-30 |
| 10521879 | Overlaying multi-source media in VRAM | Chung-Chou Yeh, Yu-Ju Tseng | 2019-12-31 |
| 10332296 | Overlaying multi-source media in VRAM | Chung-Chou Yeh, Yu-Ju Tseng | 2019-06-25 |
| 10211097 | Semiconductor device and manufacturing method thereof | Hsin-Yen Huang, Chi-Lin Teng, Shao-Kuan Lee, Hai-Ching Chen | 2019-02-19 |
| 10163797 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Jung-Hsun Tsai, Hsin-Yen Huang, Hai-Ching Chen, Tien-I Bao | 2018-12-25 |