Issued Patents All Time
Showing 1–25 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658044 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2023-05-23 |
| 11574886 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2023-02-07 |
| 11415762 | Optical bench, method of making and method of using | Shang-Yun Hou, Wan-Yu Lee | 2022-08-16 |
| 11328972 | Temporary bonding scheme | Wan-Yu Lee, Kuo-Chung Yee | 2022-05-10 |
| 11243353 | Semiconductor device and method of manufacturing | Tien-Yu Huang | 2022-02-08 |
| 11088058 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Kuo-Chung Yee | 2021-08-10 |
| 11060977 | Bio-chip package with waveguide integrated spectrometer | Jui Hsieh Lai | 2021-07-13 |
| 10983278 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2021-04-20 |
| 10957559 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2021-03-23 |
| 10866362 | Etchant and etching process for substrate of a semiconductor device | Wan-Yu Lee, Hai-Ching Chen, Tien-l Bao | 2020-12-15 |
| 10866374 | Optical bench on substrate and method of making the same | Shang-Yun Hou, Wan-Yu Lee | 2020-12-15 |
| 10866361 | Method of making a metal grating in a waveguide and device formed | Jui Hsieh Lai | 2020-12-15 |
| 10861817 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2020-12-08 |
| 10859860 | Electro-optic modulator device, optical device and method of making an optical device | Wan-Yu Lee | 2020-12-08 |
| 10840231 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Kuo-Chung Yee | 2020-11-17 |
| 10784227 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2020-09-22 |
| 10748825 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Kuo-Chung Yee | 2020-08-18 |
| 10541154 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2020-01-21 |
| 10527791 | Semiconductor device and method of manufacturing | Tien-Yu Huang | 2020-01-07 |
| 10527788 | Package structure and methods of forming same | Jui Hsieh Lai, Hai-Ching Chen, Tien-I Bao | 2020-01-07 |
| 10515942 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Kuo-Chung Yee | 2019-12-24 |
| 10510909 | Backside-illuminated photodetector structure and method of making the same | Wan-Yu Lee | 2019-12-17 |
| 10508993 | Bio-chip package with waveguide integrated spectrometer | Jui Hsieh Lai | 2019-12-17 |
| 10510707 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2019-12-17 |
| 10502894 | Method of making a metal grating in a waveguide and device formed | Jui Hsieh Lai | 2019-12-10 |