Issued Patents All Time
Showing 26–50 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490492 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Kuo-Chung Yee | 2019-11-26 |
| 10361323 | Backside-illuminated photodetector structure and method of making the same | Wan-Yu Lee | 2019-07-23 |
| 10353147 | Etchant and etching process for substrate of a semiconductor device | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2019-07-16 |
| 10276471 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Kuo-Chung Yee | 2019-04-30 |
| 10269694 | Apparatus and method for chip placement and molding | Jui Hsieh Lai, Kuo-Chung Yee | 2019-04-23 |
| 10261248 | Package structure and methods of forming same | Jui Hsieh Lai, Hai-Ching Chen, Tien-I Bao | 2019-04-16 |
| 10177082 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Kuo-Chung Yee | 2019-01-08 |
| 10170387 | Temporary bonding scheme | Wan-Yu Lee, Kuo-Chung Yee | 2019-01-01 |
| 10161875 | Bio-chip package with waveguide integrated spectrometer | Jui Hsieh Lai | 2018-12-25 |
| 10156741 | Electro-optic modulator device, optical device and method of making an optical device | Wan-Yu Lee | 2018-12-18 |
| 10157901 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Kuo-Chung Yee | 2018-12-18 |
| 10137603 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Chun-Hao Tseng, Kuo-Chung Yee | 2018-11-27 |
| 10135224 | Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die | Chun-Hao Tseng, Kuo-Chung Yee | 2018-11-20 |
| 10082626 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2018-09-25 |
| 10061079 | Method of making a metal grating in a waveguide and device formed | Jui Hsieh Lai | 2018-08-28 |
| 9960099 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2018-05-01 |
| 9902092 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Chun-Hao Tseng, Kuo-Chung Yee | 2018-02-27 |
| 9876127 | Backside-illuminated photodetector structure and method of making the same | Wan-Yu Lee | 2018-01-23 |
| 9865481 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Kuo-Chung Yee | 2018-01-09 |
| 9859199 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Kuo-Chung Yee | 2018-01-02 |
| 9857309 | Bio-chip package with waveguide integrated spectrometer | Jui Hsieh Lai | 2018-01-02 |
| 9852915 | Etching apparatus | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2017-12-26 |
| 9831634 | Apparatus and method of forming chip package with waveguide for light coupling | Chun-Hao Tseng, Kuo-Chung Yee | 2017-11-28 |
| 9806069 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Kuo-Chung Yee | 2017-10-31 |
| 9799528 | Apparatus and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Kuo-Chung Yee | 2017-10-24 |