Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362196 | Package structure with underfill | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou | 2025-07-15 |
| 11630271 | Package structure | Sung-Hui Huang, Shang-Yun Hou | 2023-04-18 |
| 11428879 | Method for forming a package structure for optical fiber | Sung-Hui Huang, Shang-Yun Hou | 2022-08-30 |
| 11328936 | Structure and formation method of package structure with underfill | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou | 2022-05-10 |
| 11150404 | Photonic package and method forming same | Sung-Hui Huang, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2021-10-19 |
| 11060977 | Bio-chip package with waveguide integrated spectrometer | Ying-Hao Kuo | 2021-07-13 |
| 10985125 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2021-04-20 |
| 10948668 | Package structure for optical fiber and method for forming the same | Sung-Hui Huang, Shang-Yun Hou | 2021-03-16 |
| 10866361 | Method of making a metal grating in a waveguide and device formed | Ying-Hao Kuo | 2020-12-15 |
| 10840231 | Semiconductor device and method of manufacturing | Ying-Hao Kuo, Kuo-Chung Yee | 2020-11-17 |
| 10790254 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2020-09-29 |
| 10748825 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2020-08-18 |
| 10656351 | Package structure for optical fiber and method for forming the same | Sung-Hui Huang, Shang-Yun Hou | 2020-05-19 |
| 10527788 | Package structure and methods of forming same | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2020-01-07 |
| 10515942 | Semiconductor device and method of manufacturing | Ying-Hao Kuo, Kuo-Chung Yee | 2019-12-24 |
| 10508993 | Bio-chip package with waveguide integrated spectrometer | Ying-Hao Kuo | 2019-12-17 |
| 10502894 | Method of making a metal grating in a waveguide and device formed | Ying-Hao Kuo | 2019-12-10 |
| 10459159 | Photonic package and method forming same | Sung-Hui Huang, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2019-10-29 |
| 10276471 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2019-04-30 |
| 10269694 | Apparatus and method for chip placement and molding | Ying-Hao Kuo, Kuo-Chung Yee | 2019-04-23 |
| 10267988 | Photonic package and method forming same | Sung-Hui Huang, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2019-04-23 |
| 10261248 | Package structure and methods of forming same | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2019-04-16 |
| 10161875 | Bio-chip package with waveguide integrated spectrometer | Ying-Hao Kuo | 2018-12-25 |
| 10157901 | Semiconductor device and method of manufacturing | Ying-Hao Kuo, Kuo-Chung Yee | 2018-12-18 |
| 10061079 | Method of making a metal grating in a waveguide and device formed | Ying-Hao Kuo | 2018-08-28 |