Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865481 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2018-01-09 |
| 9857309 | Bio-chip package with waveguide integrated spectrometer | Ying-Hao Kuo | 2018-01-02 |
| 9806069 | Semiconductor device and method of manufacturing | Ying-Hao Kuo, Kuo-Chung Yee | 2017-10-31 |
| 9799528 | Apparatus and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2017-10-24 |
| 9575249 | Method of making a metal grating in a waveguide and device formed | Ying-Hao Kuo | 2017-02-21 |
| 9530673 | Apparatus and method for self-aligning chip placement and leveling | Ying-Hao Kuo, Kuo-Chung Yee | 2016-12-27 |
| 9478475 | Apparatus and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2016-10-25 |
| 9478939 | Light coupling device and methods of forming same | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2016-10-25 |
| 9459144 | Optical spectroscopy device, process of making the same, and method of using the same | Ying-Hao Kuo | 2016-10-04 |
| 9423578 | Semiconductor device and method of manufacturing | Ying-Hao Kuo, Kuo-Chung Yee | 2016-08-23 |
| 9419156 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2016-08-16 |
| 9410893 | Bio-chip package with waveguide integrated spectrometer | Ying-Hao Kuo | 2016-08-09 |
| 9405063 | Integrated metal grating | Tien-I Bao, Hai-Ching Chen, Ying-Hao Kuo | 2016-08-02 |
| 9368375 | Apparatus and method for self-aligning chip placement and leveling | Ying-Hao Kuo, Kuo-Chung Yee | 2016-06-14 |
| 9335473 | Package structure and methods of forming same | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2016-05-10 |
| 9228896 | Optical spectroscopy device, process of making the same, and method of using the same | Ying-Hao Kuo | 2016-01-05 |
| 9099623 | Manufacture including substrate and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2015-08-04 |
| 9093449 | Apparatus and method for chip placement and molding | Ying-Hao Kuo, Kuo-Chung Yee | 2015-07-28 |
| 9041015 | Package structure and methods of forming same | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2015-05-26 |
| 8976833 | Light coupling device and methods of forming same | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2015-03-10 |